DXT696BK 180V NPN MEDIUM POWER HIGH GAIN TRANSISTOR IN TO252 Features Mechanical Data Case: TO252 (DPAK) BV > 180V CEO Case Material: Molded Plastic,Gree Molding Compound. I = 0.5A high Continuous Collector Current C UL Flammability Classification Rating 94V-0 I = 1A Peak Pulse Current CM Moisture Sensitivity: Level 1 per J-STD-020 High gain device > 500 at I =100mA C Terminals: Finish - Matte Tin Plated Leads Solderable per MIL-STD-202, Method 208 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Weight: 0.34 grams (approximate) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Applications Voltage Regulator Transistors Startup Switches Darlington Replacement DC Fans Relays and Solenoid Driving C C TO252 (DPAK) B C E BE Top View Top View Equivalent Circuit Pin-Out Ordering Information (Note 4) Product Package Marking Reel size (inches) Tape width (mm) Quantity per reel DXT696BK-13 TO252 (DPAK) DXT696B 13 16 2,500 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See DXT696BK Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage 180 V V CBO Collector-Emitter Voltage 180 V V CEO Emitter-Base Voltage V 7 V EBO Continuous Collector Current I 0.5 A C Peak Pulse Current I 1 A CM Peak Base Current I 0.5 A BM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 3.9 Power Dissipation (Note 6) P 2.1 W D (Note 7) 1.6 (Note 5) 32 Thermal Resistance, Junction to Ambient Air (Note 6) 59 R JA (Note 7) 80 C/W Thermal Resistance, Junction to Leads (Note 8) R 8.4 JL Thermal Resistance, Junction to Case (Note 9) R 14.6 JC Operating and Storage Temperature Range -55 to +150 C T , T J STG ESD Ratings (Note 10) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the exposed collector pad on 50mm x 50mm 2oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as note (5), except mounted on 25mm x 25mm 1oz copper. 7. Same as note (5), except mounted on minimum recommended pad (MRP) layout. 8. Thermal resistance from junction to solder-point (on the exposed collector pad). 9. Thermal resistance from junction to the top of the case. 10. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 December 2013 DXT696BK Diodes Incorporated www.diodes.com Document number: DS36574 Rev. 1 - 2