A Product Line of Diodes Incorporated DXT790AP5 40V PNP HIGH GAIN TRANSISTOR POWERDI Features Mechanical Data BV > -40V Case: POWERDI5 CEO I = -3A high Continuous Collector Current Case Material: Molded Plastic, Green Molding Compound. C I = -6A Peak Pulse Current UL Flammability Classification Rating 94V-0 CM 43% smaller than SOT223 60% smaller than TO252 Moisture Sensitivity: Level 1 per J-STD-020 Maximum Height Just 1.1mm Terminals: Finish Matte Tin annealed over Copper leadframe. e3 Rated up to 3.2W Solderable per MIL-STD-202, Method 208 Low Saturation, High Gain Transistor, Weight: 0.093 grams (approximate) Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability C POWERDI5 B E Top View Bottom View Device Schematic Top View Pin Out Ordering Information (Note 4) Product Marking Reel size (inches) Tape width (mm) Quantity per reel DXT790AP5-13 DXT790A 13 16 5,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See A Product Line of Diodes Incorporated DXT790AP5 Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V -50 V CBO Collector-Emitter Voltage V -40 V CEO Emitter-Base Voltage V -6 V EBO Continuous Collector Current I -3 A C Peak Pulse Current -6 A I CM Base Current -0.5 A I B Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 3.2 Power Dissipation (Note 6) P 1.7 W D (Note 7) 0.74 (Note 5) 39 Thermal Resistance, Junction to Ambient Air (Note 6) 75 C/W R JA (Note 7) 169 Thermal Resistance, Junction to Lead (Note 8) R 8.9 C/W JL Operating and Storage Temperature Range , T -55 to +150 C TJ STG Notes: 5. For a device mounted with the exposed collector pad on 50mm x 50mm 2oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as note (5), except the device is mounted on 25mm x 25mm 1oz copper. 7. Same as note (5), except the device is mounted on minimum recommended pad (MRP) layout 1oz copper. 8. Thermal resistance from junction to solder-point (on the exposed collector pad). POWERDI is a registered trademark of Diodes Incorporated. 2 of 7 June 2013 DXT790AP5 Diodes Incorporated www.diodes.com Document number: DS31800 Rev. 3 - 2