DXTN07100BFG 100V NPN HIGH PERFORMANCE TRANSISTOR IN PowerDI3333-8 Features Mechanical Data Case: PowerDI 3333-8 BV > 100V CEO Small Form Factor Thermally Efficient Package. Enables Higher Case Material: Molded Plastic. Green Molding Compound. Density End Products UL Flammability Rating 94V-0 I = 2A High Continuous Current Moisture Sensitivity: Level 1 per J-STD-020 C I = 6A Peak Pulse Current Terminals: Finish - Matte Tin Solderable per MIL-STD-202, CM Low Saturation Voltage V < 250mV 1A Method 208 CE(SAT) Complementary PNP Type: DXTP07100BFG Weight: 0.03 grams (Approximate) Rated to +175CIdeal for High Temperature Environment Wettable Flank for Improved Optical Inspection Applications Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Load Switch Linear Regulator MOSFET or IGBT Gate Driving PowerDI3333-8 (SWP) (Type UX) Equivalent Circuit C C C C B E E E Pin1 Top View Device Symbol Bottom View Ordering Information (Note 4) Part Number Marking Reel Size (inches) Tape Width (mm) Quantity per Reel DXTN07100BFG-7 2H7 7 12 2,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See DXTN07100BFG Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage 120 V V CBO Collector-Emitter Voltage 100 V V CEO Emitter-Base Voltage 7 V V EBO Continuous Collector Current 2 A I C Peak Pulse Current I 6 A CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 0.9 W Power Dissipation (Note 6) P 2.1 W D (Note 7) 3.1 W (Note 5) 140 C/W Thermal Resistance, Junction to Ambient (Note 6) 65 C/W R JA (Note 7) 44 C/W Thermal Resistance, Junction to Leads (Note 8) 8.5 C/W R JL Operating and Storage Temperature Range T T -55 to +175 C J, STG ESD Ratings (Note 9) JEDEC Class Characteristic Symbol Value Unit Electrostatic DischargeHuman Body Model ESD HBM 4000 V 3A Electrostatic DischargeMachine Model ESD MM 400 V C Notes: 5. For a device mounted with the collector tab on MRP FR4-PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as Note 5, except the device is mounted on 25mm 25mm 2oz copper. 7. Same as Note 5, except the device is mounted on 50mm 50mm 2oz copper. 8. Thermal resistance from junction to solder-point (at the collector tab). 9. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 DXTN07100BFG October 2018 Diodes Incorporated www.diodes.com Document number: DS41044 Rev. 2 - 2