DXTP03200BP5 200V PNP HIGH VOLTAGE TRANSISTOR PowerDI5 Features Mechanical Data BV = -200V Case: PowerDI 5 CEO I = -2A High Continuous Collector Current Case Material: Molded Plastic, Green Molding Compound. C UL Flammability Classification Rating 94V-0 I = -5A Peak Collector Current CM Moisture Sensitivity: Level 1 per J-STD-020 P up to 3.2W D Terminals: Finish Matte Tin Annealed over Copper Leadframe. 43% smaller than SOT223 60% smaller than TO252 (DPAK) Solderable per MIL-STD-202, Method 208 Maximum height just 1.1mm Weight: 0.093 grams (Approximate) Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Application DC DC Conversion Telecoms Power Management C C B E B E Top View Bottom View Pin-Out Diagram Device Schematic Ordering Information (Note 4) Product Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel DXTP03200BP5-13 AEC-Q101 DTP3200B 13 16 5,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See DXTP03200BP5 Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage -220 V V CBO Collector-Emitter Voltage -200 V V CEO Emitter-Base Voltage -7 V V EBO Continuous Collector Current -2 A I C Base Current I -1 A B Peak Pulse Current I -5 A CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Power Dissipation (Note 5) P 3.2 W D Thermal Resistance, Junction to Ambient Air (Note 5) 39 C/W R JA Power Dissipation (Note 6) P 1.7 W D Thermal Resistance, Junction to Ambient Air (Note 6) 75 C/W R JA Power Dissipation (Note 7) 0.74 W P D Thermal Resistance, Junction to Ambient Air (Note 7) 169 C/W R JA Thermal Resistance, Junction to Lead (Note 8) R 5.6 C/W JL Operating and Storage Temperature Range -55 to +150 C T , T J STG ESD Ratings (Note 9) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. Device mounted on FR-4 PCB, single sided 2 oz. copper, collector pad dimensions 50mm x 50mm. 6. Device mounted on FR-4 PCB, single sided 1 oz. copper, collector pad dimensions 25mm x 25mm. 7. Device mounted on FR-4 PCB, single sided 1 oz. copper, minimum recommended pad layout. 8 Thermal resistance from junction to solder-point (on the exposed collector pad). 9. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 DXTP03200BP5 December 2015 Diodes Incorporated www.diodes.com Document number: DS32068 Rev. 3 - 2 ADVANCE INFORMATION