DXTP07025BFG 25V PNP HIGH PERFORMANCE TRANSISTOR IN POWERDI3333-8 Features Mechanical Data BV > -25V Case: PowerDI 3333-8 CEO Small Form Factor Thermally Efficient Package. Case Material: Molded Plastic. Green Molding Compound Enables Higher Density End Products UL Flammability Rating 94V-0 I = -3A High Continuous Current Moisture Sensitivity: Level 1 per J-STD-020 C I = -8A Peak Pulse Current Terminals: Finish - Matte Tin Solderable per MIL-STD-202, CM Low Saturation Voltage VCE(sat) < -200mV -1A Method 208 Complementary NPN Type: DXTN07025BFG Weight: 0.03 grams (Approximate) Rated to +175C Ideal For High Temperature Environment Wettable Flank For Improved Optical Inspection Applications Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) High-Side Switch Halogen and Antimony Free. Green Device (Note 3) Low Drop Out Regulator Qualified to AEC-Q101 Standards for High Reliability MOSFET or IGBT Gate Driving PowerDI3333-8 (SWP) (Type UX) Equivalent Circuit C C C C B E E E Pin1 Top View Device Symbol Bottom View Ordering Information (Notes 4) Part Number Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel DXTP07025BFG-7 AEC-Q101 2H9 7 12 2000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See DXTP07025BFG Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V -35 V CBO Collector-Emitter Voltage V -25 V CEO Emitter-Base Voltage -7 V V EBO Continuous Collector Current -3 A I C Peak Pulse Current -8 A I CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 0.9 W Power Dissipation (Note 6) P 2.1 W D (Note 7) 3.1 W (Note 5) 140 C/W Thermal Resistance, Junction to Ambient (Note 6) 65 C/W R JA (Note 7) 44 C/W Thermal Resistance, Junction to Leads (Note 8) R 8.5 C/W JL Operating and Storage Temperature Range T T -55 to +175 C J, STG ESD Ratings (Note 9) Characteristic Symbol Value Unit JEDEC Class Electrostatic DischargeHuman Body Model ESD HBM 4000 V 3A C Electrostatic DischargeMachine Model ESD MM 400 V Notes: 1. For a device mounted with the collector tab on MRP FR4-PCB device is measured under still air conditions whilst operating in a steady-state. 2. Same as Note 5, except the device is mounted on 25mm 25mm 2oz copper. 3. Same as Note 5, except the device is mounted on 50mm 50mm 2oz copper. 4. Thermal resistance from junction to solder-point (at the collector tab). 5. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 October 2018 DXTP07025BFG www.diodes.com Diodes Incorporated Document Number DS41045 Rev. 1 - 2