A Product Line of Diodes Incorporated DXTP560BP5 500V PNP SILICON PLANAR HIGH VOLTAGE TRANSISTOR POWERDI 5 Features and Benefits Mechanical Data Case: POWERDI 5 BV > -500V CEO Case Material: Molded Plastic, Green Molding Compound. UL I = -150mA Continuous Collector Current C Flammability Classification Rating 94V-0 47% smaller than SOT223 60% smaller than TO252 (D-PAK) Moisture Sensitivity: Level 1 per J-STD-020 Profile height just 1.1mm for thin application Terminals: Finish Matte Tin annealed over Copper leadframe. R efficient giving high P rating up to 2.8W JA D Solderable per MIL-STD-202, Method 208 Lead Free, RoHS Compliant (Note 1) Weight: 0.093 grams (approximate) Halogen and Antimony Free,Gree Device (Note 2) Qualified to AEC-Q101 Standards for High Reliability Applications Gate driver Startup switch in offline lighting Motor Control C PowerDI 5 B E Top View Top View Bottom View Device Schematic Pin-Out Ordering Information (Note 3) Product Marking Reel size (inches) Tape width (mm) Quantity per reel DXTP560BP5-13 DXTP560B 13 16 5,000 Notes: 1. No purposefully added lead. 2. Diodes Incs Green Policy can be found on our website at A Product Line of Diodes Incorporated DXTP560BP5 Maximum Ratings T = 25C unless otherwise specified A Characteristic Symbol Limit Unit Collector-Base Voltage V -500 CBO Collector-Emitter Voltage V -500 V CEO Emitter-Base Voltage V -7 EBO Continuous Collector Current (Note 4) I -150 C mA Peak Pulse Current -500 I CM Thermal Characteristics T = 25C unless otherwise specified A Characteristic Symbol Value Unit 2.8 (Note 4) 22.4 Power Dissipation 1.3 W (Note 5) P D Linear Derating Factor 10.4 mW/C 0.7 (Note 6) 5.6 (Note 4) 45 Thermal Resistance, Junction to Ambient (Note 5) 96 C/W R JA (Note 6) 179 Thermal Resistance, Junction to Lead (Note 7) R 14 C/W JL Operating and Storage Temperature Range -55 to +150 C T , T J STG Notes: 4. For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions the device is measured when operating in a steady-state condition. The entire exposed collector pad is attached to the heatsink. 5. Same as note (4), except the device is mounted on 25mm x 25mm 1oz copper. 6. Same as note (4), except the device is mounted on a minimum recommended pad layout of 1oz copper. 7. Thermal resistance from junction to solder-point (at the end of the collector lead). POWERDI is a registered trademark of Diodes Incorporated. 2 of 7 January 2011 DXTP560BP5 Diodes Incorporated www.diodes.com Datasheet Number: DS35054 Rev: 1 - 2 ADVANCE INFORMATION