DZTA42 300V NPN HIGH VOLTAGE TRANSISTOR IN SOT223 Features Mechanical Data BV > 300V Case: SOT223 CEO I = 500mA high Collector Current Case Material: Molded Plastic. Green Molding Compound. C 2W Power Dissipation UL Flammability Rating 94V-0 Low Saturation Voltage V < 500mV 20mA Moisture Sensitivity: Level 1 per J-STD-020 CE(sat) Complementary PNP Type: DZTA92 Terminals: Finish - Matte Tin Plated Leads, Solderable per Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) MIL-STD-202, Method 208 Halogen and Antimony Free. Green Device (Note 3) Weight: 0.112 grams (approximate) Qualified to AEC-Q101 Standards for High Reliability Applications Switch-Mode Power Supplies (SMPS) Video output stages Motor driver SOT223 C B E Top View Top View Device Symbol Pin-Out Ordering Information (Note 4) Product Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel DZTA42-13 AEC-Q101 K3M 13 12 2,500 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See DZTA42 Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V 300 V CBO Collector-Emitter Voltage V 300 V CEO Emitter-Base Voltage 6 V V EBO Collector Current 500 mA I C Base Current 100 mA I B Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 2 Power Dissipation P W D (Note 6) 1 (Note 5) 62 Thermal Resistance, Junction to Ambient R C/W JA (Note 6) 125 Thermal Resistance, Junction to Leads (Note 7) R 19.4 C/W JL Operating and Storage Temperature Range -65 to +150 C T T J, STG ESD Ratings (Note 8) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the collector lead on 50mm x 50mm 1oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as note (5), except mounted on minimum recommended pad (MRP) layout. 7. Thermal resistance from junction to solder-point (at the end of the collector lead). 8. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 January 2014 DZTA42 Diodes Incorporated www.diodes.com Datasheet Number: DS30582 Rev. 6 - 2