A Product Line of Diodes Incorporated FCX491 60V NPN MEDIUM POWER TRANSISTOR IN SOT89 Features Mechanical Data BV > 60V Case: SOT89 CEO I = 1A Continuous Collector Current Case Material: Molded Plastic. Green Molding Compound C I = 2A Peak Pulse Current UL Flammability Rating 94V-0 CM R = 195m for a Low Equivalent On-Resistance Moisture Sensitivity: Level 1 per J-STD-020 CE(sat) h Characterized up to 2A for High Current Gain Hold-Up Terminals: Finish - Matte Tin Plated Leads, Solderable per FE Complementary PNP Type: FCX591 MIL-STD-202, Method 208 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Weight: 0.055 grams (Approximate) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability PPAP Capable (Note 4) SOT89 C E C B C B E Top View Top View Equivalent Circuit Pin-Out Ordering Information (Notes 4 and 5) Product Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel FCX491TA AEC-Q101 N1 7 12mm 1,000 FCX491QTA Automotive N1 7 12mm 1,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See A Product Line of Diodes Incorporated FCX491 Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage 80 V V CBO Collector-Emitter Voltage 60 V V CEO Emitter-Base Voltage 7 V V EBO Continuous Collector Current I 1 A C Peak Pulse Current I 2 A CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 6) 1 Power Dissipation (Note 7) P 1.5 W D (Note 8) 2.0 (Note 6) 125 Thermal Resistance, Junction to Ambient Air (Note 7) R 83 JA (Note 8) 60 C/W Thermal Resistance, Junction to Lead (Note 9) 22 R JL Thermal Resistance, Junction to Case (Note 10) 16 R JC Operating and Storage Temperature Range -65 to +150 C T T J, STG ESD Ratings (Note 11) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 6. For a device mounted with the exposed collector pad on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 7. Same as Note 5, except the device is mounted on 25mm x 25mm 1oz copper. 8. Same as Note 5, except the device is mounted on 50mm x 50mm 1oz copper. 9. Thermal resistance from junction to solder-point (on the exposed collector pad). 10. Thermal resistance from junction to the top of the case. 11. Refer to JEDEC specification JESD22-A114 and JESD22-A115. FCX491 2 of 7 January 2015 Document number: DS33054 Rev. 6 - 2 Diodes Incorporated www.diodes.com