FCX558Q 400V PNP HIGH VOLTAGE TRANSISTOR IN SOT89 Description Mechanical Data Case: SOT89 This Bipolar Junction Transistor (BJT) is designed to meet the stringent requirement of automotive applications. Case Material: Molded Plastic. Green Molding Compound. UL Flammability Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Finish - Matte Tin Plated Leads. Solderable per Features MIL-STD-202, Method 208 BV > -400V Weight: 0.05 grams (Approximate) CEO I = -200mA High Continuous Current C I = -500mA Peak Pulse Current CM Excellent h Characteristics up to -100mA FE Low Saturation Voltage V < -200mV -20mA CE(sat) Complementary NPN Type: FCX458 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability PPAP Capable (Note 4) SOT89 C E C C B B E Top View Pin Out Device Symbol Top View Ordering Information (Notes 4 and 5) Product Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel FCX558QTA Automotive P58 7 12 1,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See FCX558Q Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Limit Unit Collector-Base Voltage -400 V V CBO Collector-Emitter Voltage -400 V V CEO Emitter-Base Voltage V -7 V EBO Continuous Collector Current I -200 mA C Peak Pulse Current I -500 mA CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 6) 0.7 (Note 7) 1.0 Power Dissipation P W D (Note 8) 1.5 (Note 9) 2.0 (Note 6) 178 (Note 7) 125 Thermal Resistance, Junction to Ambient Air R JA (Note 8) 83 C/W (Note 9) 60 Thermal Resistance, Junction to Lead (Note 10) 22 R JL Operating and Storage Temperature Range -65 to +150 C T T J, STG ESD Ratings (Note 11) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 6. For a device mounted with the exposed collector pad on minimum recommended pad layout (MRP) 1oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 7. Same as Note 6, except the device is mounted with the exposed collector pad on 15mm x 15mm 1oz copper. 8. Same as Note 6, except the device is mounted with the exposed collector pad on 25mm x 25mm 1oz copper. 9. Same as Note 6, except the device is mounted with the exposed collector pad on 50mm x 50mm 1oz copper. 10. Thermal resistance from junction to solder-point (on the exposed collector pad). 11. Refer to JEDEC specification JESD22-A114 and JESD22-A115. Thermal Characteristics and Derating Information 140.0 3 o T =25 C 2oz copper A 120.0 2 100.0 1oz copper 80.0 1 1oz copper 60.0 2oz copper 40.0 0 0 500 1000 1500 2000 2500 0 500 1000 1500 2000 2500 Copper Area (sqmm) Copper Area (sqmm) 2 of 7 FCX558Q March 2017 Diodes Incorporated www.diodes.com Document number: DS39500 Rev. 1 - 2 o Thermal Resistance ( C/W) Maximum Power (W)