A Product Line of Diodes Incorporated FCX591A 40V PNP SILICON PLANAR MEDIUM POWER TRANSISTOR IN SOT89 Features Mechanical Data BV > -40V Case: SOT89 CEO Maximum Continuous Current I = -1A Case material: molded plastic. Green molding compound. C Low saturation voltage V < -500mV -1A UL Flammability Rating 94V-0 CE(sat) Complementary NPN type: FCX491A Moisture Sensitivity: Level 1 per J-STD-020 Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) Terminals: Finish - Matte Tin Plated Leads, Solderable per Halogen and Antimony Free. Green Device (Note 3) MIL-STD-202, Method 208 Qualified to AEC-Q101 Standards for High Reliability Weight: 0.05 grams (Approximate) Application Power MOSFET & IGBT gate driving Low loss power switching SOT89 C E B C C B E Top View Top View Device Symbol Pin Out Ordering Information (Note 4) Product Marking Reel size (inches) Tape width (mm) Quantity per reel FCX591ATA P2 7 12 1,000 FCX591A-13R P2 13 12 4,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See A Product Line of Diodes Incorporated FCX591A Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Limit Unit Collector-Base Voltage V -40 V CBO Collector-Emitter Voltage V -40 V CEO Emitter-Base Voltage V -7 V EBO Continuous Collector Current I -1 A C Peak Pulse Current -2 A I CM Peak Base Current -200 mA I B Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 5) P 1 W D Thermal Resistance, Junction to Ambient Air (Note 5) R 125 C/W JA Thermal Resistance, Junction to Leads (Note 6) R 10.01 C/W JL Operating and Storage Temperature Range T T -65 to +150 C J, STG ESD Ratings (Note 7) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 8,000 V 3B Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device surface mounted on 15mm X 15mm FR4 PCB with high coverage of single sided 1 oz copper, in still air conditions device measured when operating in steady state condition. 6. Thermal resistance from junction to solder-point (on the exposed collector pad). 7. Refer to JEDEC specification JESD22-A114 and JESD22-A115. FCX591A 2 of 7 October 2012 Diodes Incorporated Datasheet Number: DS33062 Rev. 6 - 2 www.diodes.com