A Product Line of Diodes Incorporated FCX593 100V PNP MEDIUM POWER TRANSISTOR IN SOT89 Features Mechanical Data BV > -100V Case: SOT89 CEO I = -1A high Continuous Collector Current Case Material: Molded Plastic. Green Molding Compound C I = -2A Peak Collector Current UL Flammability Rating 94V-0 CM Low saturation voltage V < -200mV -250mA Moisture Sensitivity: Level 1 per J-STD-020 CE(sat) Complementary NPN type: FCX493 Terminals: Finish - Matte Tin Plated Leads, Solderable per Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) MIL-STD-202, Method 208 Halogen and Antimony Free. Green Device (Note 3) Weight: 0.05 grams (Approximate) Qualified to AEC-Q101 Standards for High Reliability SOT89 C E B C C B E Top View Top View Device Symbol Pin Out Ordering Information (Note 4) Product Marking Reel size (inches) Tape width (mm) Quantity per reel FCX593TA P93 7 12 1,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See A Product Line of Diodes Incorporated FCX593 Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Limit Unit Collector-Base Voltage V -120 V CBO Collector-Emitter Voltage V -100 V CEO Emitter-Base Voltage V -7 V EBO Continuous Collector Current I -1 A C Peak Pulse Current I -2 A CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 1 Power Dissipation (Note 6) P 1.5 W D (Note 7) 2.0 (Note 5) 125 Thermal Resistance, Junction to Ambient Air (Note 6) 83 R JA (Note 7) 60 C/W Thermal Resistance, Junction to Lead (Note 8) R 22 JL Thermal Resistance, Junction to Case (Note 9) R 16 JC Operating and Storage Temperature Range T T -55 to +150 C J, STG ESD Ratings (Note 10) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the exposed collector pad on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as note (5), except the device is mounted on 25mm x 25mm 1oz copper. 7. Same as note (5), except the device is mounted on 50mm x 50mm 1oz copper. 8. Thermal resistance from junction to solder-point (on the exposed collector pad). 9. Thermal resistance from junction to the top of the case. 10. Refer to JEDEC specification JESD22-A114 and JESD22-A115. FCX593 2 of 7 January 2014 Diodes Incorporated Datasheet Number: DS33063 Rev. 5 - 2 www.diodes.com