FMMT494Q 120V NPN SILICON PLANAR MEDIUM POWER TRANSISTOR IN SOT23 Feature Mechanical Data Case: SOT23 (Type DN) This Bipolar Junction Transistor (BJT) is designed to meet the Case Material: Molded Plastic, Green Molding Compound. stringent requirements of Automotive Applications. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Finish Matte Tin Plated Leads, Solderable per Feature MIL-STD-202, Method 208 BV > 120V CEO Weight: 0.008 grams (Approximate) I = 1A Continuous Collector Current C I = 2A Peak Pulse Current CM 500mW Power Dissipation h characterised up to 1A for high current gain hold up FE Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability PPAP capable (Note 4) SOT23 (Type DN) C E C B B E Top View Device Symbol Top View Pin-Out Ordering Information (Notes 4 & 5) Part Number Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel FMMT494QTA Automotive 494 7 8 3,000 FMMT494QTC Automotive 494 13 8 10,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See FMMT494Q Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V 140 V CBO Collector-Emitter Voltage V 120 V CEO Emitter-Base Voltage 7 V V EBO Continuous Collector Current 1 A I C Peak Pulse Current 2 A I CM Base Current 200 mA I B Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Power Dissipation (Note 6) P 500 mW D Thermal Resistance, Junction to Ambient (Note 6) R 250 C/W JA Thermal Resistance, Junction to Lead (Note 7) R 197 C/W JL Operating and Storage Temperature Range -55 to +150 C TJ, TSTG ESD Ratings (Note 8) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 6. For a device surface mounted on 15mm X 15mm FR4 PCB with high coverage of single sided 1 oz copper, in still air conditions the device is measured when operating in a steady-state condition. 7. Thermal resistance from junction to solder-point (at the end of the collector lead). 8. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 FMMT494Q November 2017 Diodes Incorporated www.diodes.com Document number: DS40350 Rev. 1 - 2