A Product Line of Diodes Incorporated FMMTL717 12V PNP HIGH GAIN MEDIUM POWER TRANSISTOR IN SOT23 Features Mechanical Data BV > -12V Case: SOT23 CEO I = -1.25A Continuous Collector Current Case Material: Molded Plastic, Green Molding Compound C I = -4A Peak Pulse Current UL Flammability Classification Rating 94V-0 CM Low Saturation Voltage V < -240mV -1A Moisture Sensitivity: Level 1 per J-STD-020 CE(sat) R = 160m for a low equivalent on-resistance Terminals: Finish Matte Tin Plated Leads. Solderable per CE(SAT) 500mW power dissipation MIL-STD-202, Method 208 h characterised up to -3A for high current gain hold-up Weight 0.008 grams (approximate) FE Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability PPAP capable (Note 4) SOT23 E C C B B E Top View Device Symbol Top View Pin-Out Ordering Information (Notes 4 & 5) Product Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel FMMTL717TA AEC-Q101 L77 7 8 3,000 FMMTL717QTA Automotive L77 7 8 3,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See A Product Line of Diodes Incorporated FMMTL717 Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V -12 V CBO Collector-Emitter Voltage -12 V VCEO Emitter-Base Voltage -7 V V EBO Continuous Collector Current -1.25 A I C Peak Pulse Current -4 A I CM Base Current -200 mA I B Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Power Dissipation (Note 6) 500 mW PD Thermal Resistance, Junction to Ambient (Note 6) 250 C/W R JA Thermal Resistance, Junction to Lead (Note 7) 197 C/W R JL Operating and Storage Temperature Range -55 to +150 C T T J, STG ESD Ratings (Note 8) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 6. For a device mounted with the collector lead on 15mm x 15mm 1oz copper that is on a single-sided FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 7. Thermal resistance from junction to solder-point (at the end of the collector lead). 8. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 July 2014 FMMTL717 Diodes Incorporated www.diodes.com Document Number: DS33131 Rev. 2 - 2