FZT1049A
Green
25V NPN MEDIUM POWER TRANSISTOR IN SOT223
Features Mechanical Data
BV > 25V Case: SOT223
CEO
I = 5A high Continuous Collector Current
C Case Material: Molded Plastic. Green Molding Compound.
I = 20A Peak Pulse Current
CM
UL Flammability Rating 94V-0
Low Saturation Voltage V < 70mV @ 1A
CE(sat)
Moisture Sensitivity: Level 1 per J-STD-020
R = 50m for a low equivalent On-Resistance
CE(sat)
Terminals: Finish - Matte Tin Plated Leads.
h specified up to 20A for a high gain hold up
FE
Solderable per MIL-STD-202, Method 208
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Weight: 0.112 grams (Approximate)
Halogen and Antimony Free. Green Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
SOT223 C
B
E
Top View
Top View
Device Symbol
Pin-Out
Ordering Information (Note 4)
Product Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel
FZT1049ATA AEC-Q101 FZT1049A 7 12 1,000
FZT1049ATC AEC-Q101 FZT1049A 13 12 4,000
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See
FZT1049A
Absolute Maximum Ratings (@T = +25C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Collector-Base Voltage V 80 V
CBO
Collector-Emitter Voltage 25 V
V
CEO
Emitter-Base Voltage 7 V
V
EBO
Continuous Collector Current 5 A
I
C
Peak Pulse Current 20 A
I
CM
Thermal Characteristics (@T = +25C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
(Note 5) 3.0
(Note 6) 2.0
Power Dissipation P W
D
(Note 7) 1.6
(Note 8) 1.2
(Note 5) 41.7
(Note 6) 62.5
Thermal Resistance, Junction to Ambient
R
JA
(Note 7) 78.1
C/W
(Note 8) 104
Thermal Resistance Junction to Lead (Note 9) 10.9
R
JL
Operating and Storage Temperature Range T T -55 to +150 C
J, STG
ESD Ratings (Note 10)
Characteristic Symbol Value Unit JEDEC Class
Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A
Electrostatic Discharge - Machine Model ESD MM 400 V C
Notes: 5. For a device mounted with the collector lead on 52mm x 52mm 2oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured under
still air conditions whilst operating in a steady-state.
6. Same as note (5), except the device is mounted on 25mm x 25mm 2oz copper.
7. Same as note (5), except the device is mounted on 25mm x 25mm 1oz copper.
8. Same as note (5), except the device is mounted on minimum recommended pad layout.
9. Thermal resistance from junction to solder-point (at the end of the collector lead).
10. Refer to JEDEC specification JESD22-A114 and JESD22-A115.
FZT1049A 2 of 7
November 2015
Diodes Incorporated
Datasheet Number: DS33183 Rev. 3 - 2 www.diodes.com