Green FZT1147A 12V PNP MEDIUM POWER HIGH GAIN TRANSISTOR IN SOT223 Features and Benefits Mechanical Data BV > -12V CEO Case: SOT223 Maximum Continuous Current I = -5A C Case Material: Molded Plastic, Green Molding Compound. Peak Pulse Current I = -20A UL Flammability Classification Rating 94V-0 C Moisture Sensitivity: Level 1 per J-STD-020 High Gain Holds Up h > 200 I = -2A FE C Very Low Equivalent On-Resistance R = 85m at -2A Terminals: Finish Matte Tin Plated Leads, Solderable per MIL- CE(sat) STD-202, Method 208 Lead-Free Finish RoHS Compliant (Notes 1 & 2) Weight: 0.112 grams (Approximate) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability C SOT223 B E Top View Device Symbol Top View Pin Out Ordering Information (Note 4) Part Number Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel FZT1147ATA AEC-Q101 FZT1147A 7 12 1,000 Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See FZT1147A Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V -15 V CBO Collector-Emitter Voltage V -12 V CEO Emitter-Base Voltage V -7 V EBO Continuous Collector Current I -5 A C Base Current I -500 mA B Peak Pulse Current -20 A ICM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 3.0 (Note 6) 2.0 Power Dissipation W P D (Note 7) 1.6 (Note 8) 1.2 (Note 5) 41.7 (Note 6) 62.5 Thermal Resistance, Junction to Ambient R JA (Note 7) 78.1 C/W (Note 8) 104 Thermal Resistance Junction to Lead (Note 9) 10.9 R JL Operating and Storage Temperature Range -55 to +150 C T T J, STG ESD Ratings (Note 10) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the collector lead on 52mm x 52mm 2oz copper that is on a single-sided 1.6mm FR-4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as note (5), except the device is mounted on 25mm x 25mm 2oz copper. 7. Same as note (5), except the device is mounted on 25mm x 25mm 1oz copper. 8. Same as note (5), except the device is mounted on minimum recommended pad layout. 9. Thermal resistance from junction to solder-point (at the end of the collector lead). 10. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 FZT1147A June 2016 Diodes Incorporated www.diodes.com Document number: DS33186 Rev. 3 - 2