A Product Line of Diodes Incorporated Green FZT658 400V NPN HIGH VOLTAGE TRANSISTOR IN SOT223 Features Mechanical Data BV > 400V Case: SOT223 CEO I = 500mA High Continuous Current Case Material: Molded Plastic. Green Molding Compound C I = 1A Peak Pulse Current UL Flammability Rating 94V-0 CM Low Saturation Voltage V < 250mV 50mA Moisture Sensitivity: Level 1 per J-STD-020 CE(SAT) h > 40 Specified up to 200mA for High Current Gain Hold-Up Terminals: Finish - Matte Tin Plated Leads, Solderable per FE Complementary PNP Type: FZT758 MIL-STD-202, Method 208 Lead-Free Finish RoHS Compliant (Notes 1 & 2) Weight: 0.112 grams (Approximate) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability SOT223 Top View Top View Device Symbol Pin-Out Ordering Information (Note 4) Product Marking Reel Size (inches) Tape Width (mm) Quantity per Reel FZT658TA FZT658 7 12 1,000 Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See A Product Line of Diodes Incorporated FZT658 Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage 400 V V CBO Collector-Emitter Voltage 400 V V CEO Emitter-Base Voltage 7 V V EBO Continuous Collector Current 0.5 A I C Peak Pulse Current I 1 A CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 3.0 (Note 6) 2.0 Power Dissipation W P D (Note 7) 1.6 (Note 8) 1.2 (Note 5) 41.7 (Note 6) 62.5 Thermal Resistance, Junction to Ambient R JA (Note 7) 78.1 C/W (Note 8) 104 Thermal Resistance Junction to Lead (Note 9) 12.9 R JL Operating and Storage Temperature Range -55 to +150 C T T J, STG ESD Ratings (Note 10) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the collector lead on 50mm x 50mm 2oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as Note 5, except the device is mounted on 25mm x 25mm 2oz copper. 7. Same as Note 5, except the device is mounted on 25mm x 25mm 1oz copper. 8. Same as Note 5, except the device is mounted on minimum recommended pad layout. 9. Thermal resistance from junction to solder-point (at the end of the collector lead). 10. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 FZT658 June 2015 Diodes Incorporated www.diodes.com Document Number DS33153 Rev. 6 - 2