A Product Line of Diodes Incorporated Green FZ T689B 5 20V NPN MEDIUM POWER HIGH GAIN TRANSISTOR IN SOT223 Features Mechanical Data BV > 20V Case: SOT223 CEO BV > 20V Case Material: Molded Plastic, Green Molding Compound CBO I = 3.0A High Continuous Current UL Flammability Rating 94V-0 C hFE > 400 2A and Low Saturation Voltage Moisture Sensitivity: Level 1 per J-STD-020 Extremely Low Equivalent On-Resistance RCE( ) 92m at 3A Terminals: Finish - Matte Tin Plated Leads. Solderable per SAT Complementary PNP Type: FZT789B MIL-STD-202, Method 208 Lead-Free Finish RoHS Compliant (Notes 1 & 2) Weight: 0.112 grams (Approximate) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Applications Darlington Replacement Flash Gun Convertors and Battery Powered Circuits C SOT223 E B C C B E Top View Top View Device Symbol Pin-Out Ordering Information (Note 4) Product Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel FZT689BTA AEC-Q101 FZT689B 7 12 1,000 Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See A Product Line of Diodes Incorporated FZT689B 5 Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V 20 V CBO Collector-Emitter Voltage V 20 V CEO Emitter-Base Voltage V 7 V EBO Continuous Collector Current I 3 A C Peak Pulse Current 8 A I CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 3.0 (Note 6) 2.0 Power Dissipation P W D (Note 7) 1.6 (Note 8) 1.2 (Note 5) 41.7 (Note 6) 62.5 Thermal Resistance, Junction to Ambient R JA (Note 7) 78.1 C/W (Note 8) 104 Thermal Resistance Junction to Lead (Note 9) 12.9 R JL Operating and Storage Temperature Range T T -55 to +150 C J, STG ESD Ratings (Note 10) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the collector lead on 50mm x 50mm 2oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as Note 6, except the device is mounted on 25mm x 25mm 2oz copper. 7. Same as Note 6, except the device is mounted on 25mm x 25mm 1oz copper. 8. Same as Note 6, except the device is mounted on minimum recommended pad layout. 9. Thermal resistance from junction to solder-point (at the end of the collector lead). 10. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 FZT689B May 2015 Diodes Incorporated www.diodes.com Document number: DS33155 Rev. 4 - 2