FZT692BTA Diodes Incorporated

A Product Line of Diodes Incorporated Green FZ T692B 5 70V NPN MEDIUM POWER HIGH GAIN TRANSISTOR IN SOT223 Features Mechanical Data BV > 70V Case: SOT223 CEO BV > 70V Case Material: Molded Plastic, Green Molding Compound CBO I = 2.0A High Continuous Current UL Flammability Rating 94V-0 C hFE > 400 for High Gain 0.5A Moisture Sensitivity: Level 1 per J-STD-020 Lead-Free Finish RoHS Compliant (Notes 1 & 2) Terminals: Finish - Matte Tin Plated Leads. Solderable per Halogen and Antimony Free. Green Device (Note 3) MIL-STD-202, Method 208 Qualified to AEC-Q101 Standards for High Reliability Weight: 0.112 grams (Approximate) PPAP Capable (Note 4) Applications Darlington Replacement Relay and Solenoid Drivers DC-DC Converters C SOT223 E B C C B E Top View Top View Device Symbol Pin-Out Ordering Information (Notes 4 & 5) Product Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel FZT692BTA AEC-Q101 FZT692B 7 12 1,000 FZT692BQTA Automotive FZT692B 7 12 1,000 Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See A Product Line of Diodes Incorporated FZT692B 5 Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V 70 V CBO Collector-Emitter Voltage V 70 V CEO Emitter-Base Voltage V 7 V EBO Continuous Collector Current I 2 A C Peak Pulse Current 5 A I CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 6) 3.0 (Note 7) 2.0 Power Dissipation P W D (Note 8) 1.6 (Note 9) 1.2 (Note 6) 41.7 (Note 7) 62.5 Thermal Resistance, Junction to Ambient R JA (Note 8) 78.1 C/W (Note 9) 104 Thermal Resistance Junction to Lead (Note 10) 12.9 R JL Operating and Storage Temperature Range T T -55 to +150 C J, STG ESD Ratings (Note 11) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 6. For a device mounted with the collector lead on 50mm x 50mm 2oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 7. Same as Note 6, except the device is mounted on 25mm x 25mm 2oz copper. 8. Same as Note 6, except the device is mounted on 25mm x 25mm 1oz copper. 9. Same as Note 6, except the device is mounted on minimum recommended pad layout. 10. Thermal resistance from junction to solder-point (at the end of the collector lead). 11. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 FZT692B March 2015 Diodes Incorporated www.diodes.com Document number: DS33157 Rev. 6 - 2