A Product Line of Diodes Incorporated Green FZT855 150V NPN MEDIUM POWER TRANSISTOR IN SOT223 Features Mechanical Data BV > 150V Case: SOT223 CEO I = 5A High Continuous Collector Current Case Material: Molded Plastic. Green Molding Compound C I = 10A Peak Pulse Current UL Flammability Rating 94V-0 CM Very Low Saturation Voltage V < 110mV 1A Moisture Sensitivity: Level 1 per J-STD-020 CE(sat) R = 50m for a Low Equivalent On-Resistance Terminals: Finish - Matte Tin Plated Leads Solderable per CE(sat) h Specified Up to 10A for a High Gain Hold-Up MIL-STD-202, Method 208 FE Complementary PNP Type: FZT955 Weight: 0.112 grams (Approximate) Lead-Free Finish RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability SOT223 C B E Top View Top View Device Symbol Pin-Out Ordering Information (Note 4) Product Marking Reel size (inches) Tape width (mm) Quantity per reel FZT855TA FZT855 7 12 1,000 Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See A Product Line of Diodes Incorporated FZT855 Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage 250 V V CBO Collector-Emitter Voltage 150 V V CEO Emitter-Base Voltage V 7 V EBO Continuous Collector Current I 5 A C Peak Pulse Current I 10 A CM Base Current I 1 A B Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit 3.0 (Note 5) Power Dissipation 24 W P D Linear Derating Factor 1.6 mW/C (Note 6) 12.8 (Note 5) 42 R JA Thermal Resistance, Junction to Ambient (Note 6) 78 C/W R JA Thermal Resistance Junction to Lead (Note 7) 8.8 R JL Operating and Storage Temperature Range T T -55 to +150 C J, STG ESD Ratings (Note 8) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 8,000 V 3B Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device surface mounted on 52mm X 52mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions device measured when operating in steady state condition. 6. Same as Note 5, except the device is mounted on 25mm X 25mm single sided 1oz weight copper. 7. Thermal resistance from junction to solder-point (at the end of the collector lead). 8. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 FZT855 May 2015 Diodes Incorporated www.diodes.com Document Number DS33176 Rev. 6 - 2