MJD31C-13 Diodes Incorporated

MJD31C 100V NPN HIGH VOLTAGE TRANSISTOR IN TO252 Features Mechanical Data BV > 100V Case: TO252 (DPAK) CEO I = 3A high Continuous Collector Current Case Material: Molded Plastic,Gree Molding Compound C I = 5A Peak Pulse Current UL Flammability Classification Rating 94V-0 CM Ideal for Power Switching or Amplification Applications Moisture Sensitivity: Level 1 per J-STD-020 Complementary PNP Type: MJD32C Terminals: Finish Matte Tin Plated Leads, Solderable per Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) MIL-STD-202, Method 208 Halogen and Antimony Free. Green Device (Note 3) Weight: 0.34 grams (Approximate) Qualified to AEC-Q101 Standards for High Reliability TO252 (DPAK) C B E Top View Pin Out Configuration Device Schematic Top View Ordering Information (Note 4) Product Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel MJD31C-13 AEC-Q101 MJD31C 13 16 2,500 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See MJD31C Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V 100 V CBO Collector-Emitter Voltage V 100 V CEO Emitter-Base Voltage V 6 V EBO Continuous Collector Current I 3 A C Peak Pulse Collector Current I 5 A CM Continuous Base Current 1 A I B Power Dissipation 15 W P D Thermal Characteristics ( TA = +25C, unless otherwise specified.) Characteristic Symbol Value Unit (Note 5) 3.9 Power Dissipation (Note 6) 2.1 W P D (Note 7) 1.6 (Note 5) 32 Thermal Resistance, Junction to Ambient Air (Note 6) R 59 JA C/W (Note 7) 80 Thermal Resistance, Junction to Leads (Note 8) 8.4 R JL Operating and Storage Temperature Range T , T -55 to +150 C J STG ESD Ratings (Note 9) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the exposed collector pad on 50mm x 50mm 2oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as note (5), except mounted on 25mm x 25mm 1oz copper. 7. Same as note (5), except mounted on minimum recommended pad (MRP) layout. 8. Thermal resistance from junction to solder-point (on the exposed collector pad). 9. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 MJD31C June 2016 Diodes Incorporated www.diodes.com Document number: DS31625 Rev. 7 - 2