MJD32CUQ 100V PNP HIGH VOLTAGE TRANSISTOR IN TO252 (DPAK) Description Mechanical Data This Bipolar Junction Transistor (BJT) is designed to meet the Case: TO252 (DPAK) stringent requirements of Automotive Applications. Case Material: Molded Plastic,Gree Molding Compound UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Features Terminals: Finish Matte Tin Plated Leads, Solderable per BV > -100V CEO MIL-STD-202, Method 208 I = -3A High Continuous Collector Current C Weight: 0.34 grams (Approximate) I = -5A Peak Pulse Current CM Ideal for Power Switching or Amplification Applications Complementary NPN Type: MJD31CUQ Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability PPAP Capable (Note 4) TO252 (DPAK) C B E Top View Pin Out Configuration Device Schematic Top View Ordering Information (Notes 4 & 5) Part number Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel MJD32CUQ-13 Automotive MJD32CU 13 16 2,500 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See MJD32CUQ Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V -120 V CBO Collector-Emitter Voltage V -100 V CEO Emitter-Base Voltage V -7 V EBO Continuous Collector Current I -3 A C Peak Pulse Collector Current I -5 A CM Continuous Base Current I -1 A B Power Dissipation 15 W P D Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 6) 3.9 Power Dissipation (Note 7) P 2.1 W D (Note 8) 1.6 (Note 6) 32 Thermal Resistance, Junction to Ambient Air (Note 7) R 59 JA C/W (Note 8) 80 Thermal Resistance, Junction to Leads (Note 9) 3.6 R JL Operating and Storage Temperature Range -55 to +150 C T , T J STG ESD Ratings (Note 10) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 6. For a device mounted with the exposed collector pad on 50mm x 50mm 2oz copper that is on a single-sided 1.6mm FR-4 PCB device is measured under still air conditions whilst operating in a steady-state. 7. Same as note (6), except mounted on 25mm x 25mm 1oz copper. 8. Same as note (6), except mounted on minimum recommended pad (MRP) layout. 9. Thermal resistance from junction to solder-point (on the exposed collector pad). 10. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 MJD32CUQ December 2017 Diodes Incorporated www.diodes.com Document number: DS39134 Rev. 2 - 2