MMBT3906-7-F Diodes Incorporated

MMBT3906 40V PNP SMALL SIGNAL TRANSISTOR IN SOT23 Features Mechanical Data Epitaxial Planar Die Construction Case: SOT23 Ideal for Medium Power Amplification and Switching Case Material: Molded Plastic, Green Molding Compound Complementary NPN Type: MMBT3904 UL Flammability Classification Rating 94V-0 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Moisture Sensitivity: Level 1 per J-STD-020 Halogen and Antimony Free. Green Device (Note 3) Terminals: FinishMatte Tin Plated Leads, Qualified to AEC-Q101 Standards for High Reliability Solderable per MIL-STD-202, Method 208 PPAP Capable (Note 4) Weight: 0.008 grams (Approximate) SOT23 C B E Top View Top View Device Symbol Pin-Out Ordering Information (Notes 4 & 5) Product Status Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel MMBT3906-7-F Active AEC-Q101 K3N 7 8 3000 MMBT3906Q-7-F Active Automotive K3N 7 8 3000 MMBT3906Q-13-F Active Automotive K3N 13 8 10,000 MMBT3906-13-F Active AEC-Q101 K3N 13 8 10,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See MMBT3906 Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V -40 V CBO Collector-Emitter Voltage V -40 V CEO Emitter-Base Voltage V -6.0 V EBO Collector Current I -200 mA C Peak Collector Current I -200 mA CM Peak Base Current I -100 mA BM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 6) 310 Power Dissipation mW P D (Note 7) 350 (Note 6) 403 Thermal Resistance, Junction to Ambient R C/W JA (Note 7) 357 Thermal Resistance, Junction to Leads (Note 8) R 350 C/W JL Operating and Storage Temperature Range -55 to +150 C TJ,TSTG ESD Ratings (Note 9) Characteristic Symbol Value Unit JEDEC Class Electrostatic DischargeHuman Body Model ESD HBM 4000 V 3A Electrostatic DischargeMachine Model ESD MM 400 V C Notes: 6. For a device mounted on minimum recommended pad layout 1oz copper that is on a single-sided FR4 PCB the device is measured under still air conditions while operating in a steady-state. 7. Same as Note 6 except the device is mounted on 15 mm 15mm 1oz copper. 8. Thermal resistance from junction to solder-point (at the end of the leads). 9. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 June 2018 MMBT3906 Diodes Incorporated www.diodes.com Document number: DS30059 Rev. 21 - 2