3N 3N 3N MMBT3906LP 40V PNP SMALL SIGNAL TRANSISTOR IN DFN1006 Features Mechanical Data BV > -40V Case: X1-DFN1006-3 CEO I = -200mA High Collector Current Case Material: Molded Plastic,Gree Molding Compound. C P = 1000mW Power Dissipation UL Flammability Classification Rating 94V-0 D 2 0.60mm Package Footprint, 13 times Smaller than SOT23 Moisture Sensitivity: Level 1 per J-STD-020 0.5mm Height Package Minimizing Off-Board Profile Terminals: Finish NiPdAu, e4 Complementary NPN Type MMBT3904LP Solderable per MIL-STD-202, Method 208 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Weight: 0.0008 grams (Approximate) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability C X1-DFN1006-3 B C B E E Top View Bottom View Device Symbol Device Schematic Ordering Information (Note 4) Product Marking Reel size (inches) Tape width (mm) Quantity per reel MMBT3906LP-7 3N 7 8 3,000 MMBT3906LP-7B 3N 7 8 10,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See MMBT3906LP Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V -40 V CBO Collector-Emitter Voltage V -40 V CEO Emitter-Base Voltage V -6.0 V EBO Collector Current I -200 mA C Peak Collector Current -200 mA I CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 400 Power Dissipation P mW D (Note 6) 1000 (Note 5) 310 Thermal Resistance, Junction to Ambient C/W R JA (Note 6) 120 Thermal Resistance, Junction to Lead (Note 7) 120 C/W R JL Operating and Storage and Temperature Range -55 to +150 C T , T J STG ESD Ratings (Note 8) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 200 V B Notes: 5. For the device mounted on minimum recommended pad layout 1oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in steady state condition. The entire exposed collector pad is attached to the heatsink. 6. Same as Note 5, except the exposed collector pad is mounted on 25mm x 25mm 2oz copper. 7. Thermal resistance from junction to solder-point (on the exposed collector pad). 8. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 MMBT3906LP May 2015 Diodes Incorporated www.diodes.com Document number: DS31836 Rev. 7 - 2 ADVANCE INFORMATION