MMBTA05 / MMBTA06 NPN SMALL SIGNAL TRANSISTOR IN SOT23 Features Mechanical Data Epitaxial Planar Die Construction Case: SOT23 Ideal for Low Power Amplification and Switching Case Material: Molded Plastic, Green Molding Compound Complementary PNP Type: MMBTA55 & MMBTA56 UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) Terminals: Finish Matte Tin Plated Leads, Solderable per Halogen and Antimony Free. Green Device (Note 3) MIL-STD-202, Method 208 Qualified to AEC-Q101 Standards for High Reliability PPAP capable (Note 4) Weight: 0.008 grams (approximate) SOT23 C E B C B E Top View Top View Device Symbol Pin Configuration Ordering Information (Notes 4 & 5) Product Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel MMBTA05-7-F AEC-Q101 K1G / K1H 7 8 3,000 MMBTA05Q-13-F Automotive K1G / K1H 13 8 10,000 MMBTA06-7-F AEC-Q101 K1G 7 8 3,000 MMBTA06Q-7-F Automotive K1G 7 8 3,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See MMBTA05 / MMBTA06 Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol MMBTA05 MMBTA06 Unit Collector-Base Voltage 60 80 V V CBO Collector-Emitter Voltage 60 80 V V CEO Emitter-Base Voltage V 4.0 V EBO Collector Current I 500 mA C Peak Collector Current I 1 A CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 6) 310 Power Dissipation P mW D (Note 7) 350 (Note 6) 403 Thermal Resistance, Junction to Ambient R C/W JA (Note 7) 357 Thermal Resistance, Junction to Leads (Note 8) 350 C/W R JL Operating and Storage Temperature Range -55 to +150 T T C J, STG ESD Ratings (Note 9) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 6. For a device mounted on minimum recommended pad layout 1oz copper that is on a single-sided FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 7. Same as note (6), except the device is mounted on 15 mm x 15mm 1oz copper. 8. Thermal resistance from junction to solder-point (at the end of the leads). 9. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 November 2013 MMBTA05 / MMBTA06 Diodes Incorporated www.diodes.com Document number: DS30037 Rev. 14 - 2