MMBTA55 / MMBTA56 PNP SMALL SIGNAL TRANSISTOR IN SOT23 Features Mechanical Data Epitaxial Planar Die Construction Case: SOT-23 Ideal for Low Power Amplification and Switching Case Material: Molded Plastic, Green Molding Compound Complementary NPN Type: MMBTA05 / MMBTA06 UL Flammability Classification Rating 94V-0 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Moisture Sensitivity: Level 1 per J-STD-020 Halogen and Antimony Free. Green Device (Note 3) Terminals: Finish-Matte Tin Plated Leads. Qualified to AEC-Q101 Standards for High Reliability Solderable per MIL-STD-202, Method 208 PPAP Capable (Note 4) Weight: 0.008 grams (Approximate) SOT23 C E B C B E Top View Top View Device Symbol Pin-Out Symbolhematic Symbolhematic Ordering Information (Notes 4 & 5) Part Number Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel MMBTA55-7-F AEC-Q101 K2G 7 8 3,000 MMBTA56-7-F AEC-Q101 K2G 7 8 3,000 MMBTA56Q-7-F Automotive K2G 7 8 3,000 MMBTA56Q-13-F Automotive K2G 13 8 10,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See MMBTA55 / MMBTA56 Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol MMBTA55 MMBTA56 Unit Collector-Base Voltage V -60 -80 V CBO Collector-Emitter Voltage V -60 -80 V CEO Emitter-Base Voltage V -4.0 V EBO Collector Current - Continuous -500 mA IC Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 6) 310 Power Dissipation P mW D (Note 7) 350 (Note 6) 403 Thermal Resistance, Junction to Ambient R C/W JA (Note 7) 357 Thermal Resistance, Junction to Leads (Note 8) 350 C/W R JL Operating and Storage Temperature Range -55 to +150 C T T J, STG ESD Ratings (Note 9) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 6. For a device mounted on minimum recommended pad layout 1oz copper that is on a single-sided FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 7. Same as Note 6, except the device is mounted on 15 mm x 15mm 1oz copper. 8. Thermal resistance from junction to solder-point (at the end of the leads). 9. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 MMBTA55/MMBTA56 September 2015 Diodes Incorporated www.diodes.com Document number: DS30054 Rev. 13 - 2