A Product Line of
Diodes Incorporated
ZTX796A
200V PNP MEDIUM POWER HIGH GAIN TRANSISTOR IN E-LINE
Features Mechanical Data
BV > -200V Case: E-Line (TO-92 Compatible)
CEO
I = -0.5A High Continuous Collector Current Case Material: molded plastic, Green Molding Compound
C
I = -1A Peak Pulse Current UL Flammability Classification Rating 94V-0
CM
T up to 200C for High Temperature Operation Terminals: Finish Matte Tin Plated Leads, Solderable per
J
h > 250 @ 0.3A for High Gain Hold-Up MIL-STD-202, Method 208
FE
P = 1W Power dissipation Weight: 0.159 grams (approximate)
D
Complementary NPN Type: ZTX696B
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
Halogen and Antimony Free. Green Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Part Mark on
E-Line
Rounded Face
(TO-92 Compatible)
C
Ejection Mark
C B E
on Flat Face
Bottom View
B
E
C B
C B E E
Rounded Face View
Flat Face View
Device Symbol Pin-Out Configuration
Ordering Information (Note 4)
Product Marking Package Leads Quantity
ZTX796ASTZ ZTX796A E-Line Joggled 2,000 Taped per Ammo Box
ZTX796A ZTX796A E-Line Straight 4,000 Loose in a Box
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See
A Product Line of
Diodes Incorporated
ZTX796A
Maximum Ratings (@T = +25C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Collector-Base Voltage V -200 V
CBO
Collector-Emitter Voltage V -200 V
CEO
Emitter-Base Voltage -5 V
V
EBO
Continuous Collector Current -0.5 A
I
C
Peak Pulse Current -1 A
I
CM
Thermal Characteristics (@T = +25C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Power Dissipation (Note 5) P 1.5 W
D
Power Dissipation (Note 6) P 1 W
D
Thermal Resistance Junction to Ambient (Note 5) 116 C/W
R
JA
Thermal Resistance Junction to Ambient (Note 6) 175 C/W
R
JA
Thermal Resistance Junction to Lead (Note 7) 70 C/W
R
JL
Operating and Storage Temperature Range -55 to +200 C
T T
J, STG
Notes: 5. For a through-hole device mounted at the seating plane (2.5mm lead length) with the collector lead on 25mm x 25mm 1oz copper
that is on a single-sided FR4 PCB; device is measured under still air conditions whilst operating in a steady-state.
6. Same as note (5), except the device is mounted on minimum recommended pad layout with 12mm lead length from the bottom of package to the board.
7. Thermal resistance from junction to solder-point at the seating plane (2.5mm from the bottom of package along the collector lead).
2 of 7 May 2013
ZTX796A
Diodes Incorporated
www.diodes.com
Document Number DS31908 Rev. 3 - 2