ZTX855 Diodes Incorporated

A Product Line of Diodes Incorporated ZTX855 150V NPN MEDIUM POWER TRANSISTOR IN E-LINE Features Mechanical Data Case: E-Line (TO-92 Compatible) BV > 150V CEO I = 4A High Continuous Collector Current Case Material: molded plastic, Green Molding Compound C I = 10A Peak Pulse Current UL Flammability Classification Rating 94V-0 CM T up to 200C for High Temperature Operation Terminals: Finish Matte Tin Plated Leads, Solderable per J Low Saturation Voltage < 100mV 1A MIL-STD-202, Method 208 P = 1.2W Power dissipation D Weight: 0.159 grams (approximate) Complementary NPN Type: ZTX955 Lead-Free Finish RoHS compliant (Note 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Part Mark on Rounded Face E-Line (TO-92 Compatible) C C B Ejection Mark E on Flat Face Bottom View B E C C B E B E Rounded Face View Flat Face View Device Symbol Pin-Out Configuration Ordering Information (Note 4) Product Marking Package Leads Quantity ZTX855STZ ZTX855 E-Line Joggled 2,000 taped per Ammo Box ZTX855 ZTX855 E-Line Straight 4,000 loose in a Box Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See A Product Line of Diodes Incorporated ZTX855 Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage 250 V V CBO Collector-Emitter Voltage 150 V V CEO Emitter-Base Voltage 6 V V EBO Continuous Collector Current 4 A I C Peak Pulse Current I 10 A CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Power Dissipation (Note 5) 1.58 W P D Power Dissipation (Note 6) 1.2 W P D Thermal Resistance, Junction to Ambient (Note 5) 150 R C/W JA Thermal Resistance, Junction to Ambient (Note 6) R 110 C/W JA Thermal Resistance, Junction to Lead (Note 7) R 50 C/W JC Operating and Storage Temperature Range T T -55 to +200 C J, STG ESD Ratings (Note 8) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a through-hole device mounted at the seating plane (2.5mm lead length) with the collector lead on 25mm x 25mm 1oz copper that is on a single-sided FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as note (5), except the device is mounted on minimum recommended pad layout with 12mm lead length from the bottom of package to the board. 7. Thermal resistance from junction to solder-point at the seating plane (2.5mm from the bottom of package along the collector lead). 8. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 May 2013 ZTX855 Diodes Incorporated www.diodes.com Document Number DS33136 Rev. 4 - 2