ZXM61P02F 20V P-CHANNEL ENHANCEMENT MODE MOSFET Product Summary Features and Benefits Fast switching speed I D Low on-resistance V R (BR)DSS DS(on) T = +25 C A Low threshold Low gate drive 600m V = -4.5V -0.92A GS -20V Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) 900m V = -2.7V -0.75A GS Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Mechanical Data Description and Applications Case: SOT23 This MOSFET utilizes a unique structure that combines the benefits of low on-resistance with fast switching speed, making it ideal for Case Material: Molded Plastic, UL Flammability Classification high-efficiency power management applications. Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 DC - DC converters Terminals: Matte Tin Finish Solderable per MIL-STD-202, Power management functions Method 208 Disconnect switches Weight: 0.008 grams (approximate) Motor control SOT23 D S G D G S Top View Top View Equivalent Circuit Pin Out Ordering Information (Note 4) Product Marking Reel size (inches) Tape width (mm) Quantity per reel ZXM61P02FTA P02 7 8 3000 Units Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See ZXM61P02F Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Units Drain-Source Voltage V -20 V DSS Gate-Source Voltage V 12 V GS T = +25C (Note 6) -0.9 A Continuous Drain Current V = 4.5V I A GS D -0.7 T = +70C (Note 6) A Pulsed Drain Current (Note 7) -4.9 A I DM Continuous Source Current (Body Diode) (Note 6) -0.9 A I S Pulsed Source Current (Body Diode) (Note 7) -4.9 A I SM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Power Dissipation (Note 5) 625 mW P D Linear Derating Factor 5 mW/C Power Dissipation (Note 6) 806 mW P D Linear Derating Factor 6.4 mW/C Thermal Resistance, Junction to Ambient (Note 5) 200 C/W R JA Thermal Resistance, Junction to Ambient (Note 6) 155 C/W R JA Operating and Storage Temperature Range -55 to +150 C T T J, STG Notes: 5. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions 6. For a device surface mounted on FR4 PCB measured at t 5 secs. 7. Repetitive rating 25mm x 25mm FR4 PCB, D=0.05 pulse width=10s - pulse current limited by maximum junction temperature. Thermal Characteristics 2 of 7 October 2013 ZXM61P02F Diodes Incorporated www.diodes.com Document Number DS33478 Rev. 3 - 2