X-On Electronics has gained recognition as a prominent supplier of ZXMN20B28KTC MOSFET across the USA, India, Europe, Australia, and various other global locations. ZXMN20B28KTC MOSFET are a product manufactured by Diodes Incorporated. We provide cost-effective solutions for MOSFET, ensuring timely deliveries around the world.

ZXMN20B28KTC Diodes Incorporated

ZXMN20B28KTC electronic component of Diodes Incorporated
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See Product Specifications
Part No.ZXMN20B28KTC
Manufacturer: Diodes Incorporated
Category: MOSFET
Description: MOSFET ENHANCE MODE MOSFET 200V N-CHANNEL
Datasheet: ZXMN20B28KTC Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.8395 ea
Line Total: USD 0.84

Availability - 33483
Ship by Thu. 15 Aug to Mon. 19 Aug
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
478
Ship by Fri. 16 Aug to Wed. 21 Aug
MOQ : 1
Multiples : 1
1 : USD 0.6816
10 : USD 0.5435
30 : USD 0.4847
100 : USD 0.4108
500 : USD 0.3779
1000 : USD 0.3575

33483
Ship by Thu. 15 Aug to Mon. 19 Aug
MOQ : 1
Multiples : 1
1 : USD 0.8395
10 : USD 0.7302
100 : USD 0.5048
500 : USD 0.422
1000 : USD 0.3588
2500 : USD 0.2955
5000 : USD 0.2863
25000 : USD 0.2795

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Brand
Continuous Drain Current
Drain-Source Breakdown Voltage
Forward Transconductance - Min
Power Dissipation
Rds On
Fall Time
Gate Charge Qg
Rise Time
Typical Turn-Off Delay Time
Configuration
Series
Transistor Type
Cnhts
Hts Code
Mxhts
Product Type
Factory Pack Quantity :
Subcategory
Taric
Typical Turn-On Delay Time
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We are delighted to provide the ZXMN20B28KTC from our MOSFET category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ZXMN20B28KTC and other electronic components in the MOSFET category and beyond.

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A Product Line of Diodes Incorporated ZXMN20B28K 200V N-CHANNEL ENHANCEMENT MODE MOSFET Product Summary Features and Benefits 100% Unclamped Inductive Switch (UIS) test in production I D V R High avalanche energy pulse withstand capability (BR)DSS DS(on) T = 25C A Low gate drive voltage (Logic level capable) 750m VGS = 10V 2.3A Low input capacitance 200V Low on-resistance 780m VGS = 5V 2.3A Fast switching speed Green Component and RoHS compliant (Note 1) Description and Applications Qualified to AEC-Q101 Standards for High Reliability This MOSFET features low on-resistance, fast switching and a high avalanche withstand capability, making it ideal for high efficiency Mechanical Data power management applications. Case: TO252-3L SLIC line drivers for VoIP applications Case Material: Molded Plastic Green Molding Compound, Transformer driving switch UL Flammability Classification Rating 94V-0 (Note 1) Moisture Sensitivity: Level 1 per J-STD-020 Power management functions Terminal Connections: See Diagram Motor control Terminals: Matte Tin Finish annealed over Copper leadframe. Uninterrupted power supply Solderable per MIL-STD-202, Method 208 Weight: 0.33 grams (approximate) D TO252-3L D G D S GS Top View Pin Out Top View Equivalent Circuit Ordering Information (Note 1) Product Marking Reel size (inches) Tape width (mm) Quantity per reel ZXMN20B28KTC See below 13 16 2,500 Note: 1. Diodes, Inc. defines Green products as those which are Eu RoHS compliant and contain no halogens or antimony compounds further information about Diodes Inc.s Green Policy can be found on our website. For packaging details, go to our website. Marking Information ZXMN ZXMN = Product Type Marking Code, Line 1 20B28 20B28 = Product Type Marking Code, Line 2 YYWW YYWW = Date Code Marking YY = Year (ex: 09 = 2009) WW = Week (01-52) 1 of 8 October 2009 ZXMN20B28K Diodes Incorporated www.diodes.com Document Number DS31984 Rev. 2 - 2 A Product Line of Diodes Incorporated ZXMN20B28K Maximum Ratings T = 25C unless otherwise specified A Characteristic Symbol Value Unit Drain-Source voltage 200 V V DSS Gate-Source voltage V V 20 GS Single Pulsed Avalanche Energy (Note 7) E 73 mJ AS Single Pulsed Avalanche Current (Note 7) I 5.5 A AS Repetitive Avalanche Energy (Note 4) E 4.5 mJ AR Repetitive Avalanche Current (Note 4) I 5.5 A AR (Note 3) 2.3 Continuous Drain current V = 10V T = 70C (Note 3) I 1.8 A GS A D (Note 2) 1.5 Pulsed Drain current V = 10V (Note 4) I 17.3 A GS DM Continuous Source current (Body diode) (Note 2) I 5.7 A S Pulsed Source current (Body diode) (Note 4) 17.3 A I SM Thermal Characteristics Characteristic Symbol Value Unit 4.3 (Note 2) 34.4 Power dissipation 10.2 W (Note 3) P D Linear derating factor 76.0 mW/C 2.2 (Note 6) 17.4 (Note 2) 29.1 Thermal Resistance, Junction to Ambient (Note 3) 12.3 R C/W JA (Note 6) 57.3 Thermal Resistance, Junction to Lead (Note 5) 1.15 R C/W JL Operating and storage temperature range T , T -55 to 150 C J STG Notes: 2. For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions the device is measured when operating in a steady-state condition. 3. Same as note 2, except the device is measured at t 10 sec. 4. Same as note 2, except the device is operating in a repetitive state with pulse width and duty cycle limited by maximum junction temperature. 5. Thermal resistance from junction to solder-point (at the end of the drain lead). 6. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with the high coverage single sided 1oz copper, in still air conditions the device is measured when operating in a steady-state condition. 7. UIS in production with L = 4.83mH, I = 5.5A, R = 25, V = 100V, starting T = 25C. AS G DD J 2 of 8 October 2009 ZXMN20B28K Diodes Incorporated www.diodes.com Document Number DS31984 Rev. 2 - 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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