ZXMN2A01FTA Diodes Incorporated

ZXMN2A01F 20V N-CHANNEL ENHANCEMENT MODE MOSFET Product Summary Features I D Low On-Resistance V R (BR)DSS DS(ON) T = +25C A Fast Switching Speed 20V 0.12 V = 10V 2.2A GS Low Threshold Low Gate Drive Small Surface Mount Package Description Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) This new generation MOSFET is designed to minimize the on-state Qualified to AEC-Q101 Standards for High Reliability resistance (R ) and yet maintain superior switching performance, DS(ON) making it ideal for high efficiency power management applications. Mechanical Data Case: SOT23 Applications Case Material: Molded Plastic. UL Flammability Classification DC-DC Converters Rating 94V-0 Power Management Functions Moisture Sensitivity: Level 1 per J-STD-020 Motor Control Terminals: Solderable per MIL-STD-202, Method 208 e3 Lead-free Plating (Matte Tin Finish annealed over Alloy 42 leadframe). Terminal Connections: See Diagram Weight: 0.006 grams (approximate) D D G G S S Top View Equivalent Circuit Pin Configuration Top View Ordering Information (Note 4) Part Number Case Packaging ZXMN2A01FTA SOT23 3,000/Tape & Reel ZXMN2A01FTC SOT23 10,000/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See ZXMN2A01F Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Units Drain-Source Voltage V 20 V DSS 12 Gate-Source Voltage V V GSS T = +25C (Note 6) A 2.2 (Note 6) 1.7 A Continuous Drain Current, V = 10V T = +70C I GS A D (Note 5) 1.9 T = +25C A Pulsed Drain Current (Note 7) I 8 A DM Maximum Body Diode Continuous Current (Note 6) I 1.29 A S Maximum Body Diode Continuous Current (Note 7) I 8 A SM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Units Total Power Dissipation 625 mW (Note 5) P D Linear Derating Factor 5 mW/C Total Power Dissipation 806 mW (Note 6) P D Linear Derating Factor 6.4 mW/C (Note 5) 200 Thermal Resistance, Junction to Ambient C/W R JA (Note 6) 155 Operating and Storage Temperature Range -55 to +150 C TJ, TSTG Notes: 5. For a device surface mounted on 25mm x 25mm FR-4 PCB with high coverage of single sided 1oz copper, in still air conditions. 6. For a device surface mounted on FR-4 PCB measured at t5 secs. 7. Repetitive rating 25mm x 25mm FR4 PCB, D = 0.05, pulse width 10s - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph. 2 of 7 August 2014 ZXMN2A01F Diodes Incorporated www.diodes.com Document number: DS33513 Rev. 4 - 2 ADVANCED INFORMATION