ZXMN2B03E6TA Diodes Incorporated

ZXMN2B03E6 20V SOT26 N-CHANNEL ENHANCEMENT MODE MOSFET Product Summary Features and Benefits Low On-resistance Max I D V Max R (BR)DSS DS(ON) Fast Switching Speed T = +25C A Low Gate Drive Capability 0.040 V = 4.5V 5.4A GS Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) 20V Halogen and Antimony Free. Green Device (Note 3) 4.6A 0.055 VGS = 2.5V 4.0A 0.075 V = 1.8V GS Mechanical Data Description and Applications Case: SOT26 This new generation trench MOSFET from Zetex features low on- Case Material: Molded Plastic, Green Molding Compound. UL Flammability Classification Rating 94V-0 resistance achievable with low gate drive. DC - DC Converters Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Finish Matte Tin Annealed over Copper Leadframe. Power Management Functions Solderable per MIL-STD-202, Method 208 Disconnect Switches Weight: 0.015 grams (Approximate) Motor Control SOT26 Top View Pinout Top-view Device Symbol Ordering Information (Note 4) Part Number Reel Size (inch) Tape Width (mm) Quantity Per Reel ZXMN2B03E6TA 7 8 3000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See ZXMN2B03E6 Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Drain-Source Voltage V 20 V DSS Gate-Source Voltage V 8 V GS T = +25C (Note 6) 5.4 A Continuous Drain Current V = 4.5V T = +70C (Note 6) I 4.3 A GS A D T = +25C (Note 5) 4.3 A Pulsed Drain Current (Note 7) 26 A I DM Continuous Source Current (Body Diode) (Note 6) 2.8 A I S Pulsed Source Current (Body Diode) (Note 7) 26 A I SM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit W Power Dissipation at T = +25C (Note 5) P 1.1 A D Linear derating factor (Note 5) 8.8 mW/C W Power Dissipation at T = +25C (Note 6) P 1.7 A D Linear derating factor (Note 6) 13.7 mW/C Junction to Ambient (Note 5) 113 C/W R JA Junction to Ambient (Note 6) 73 C/W R JA Operating and Storage Temperature Range -55 to +150 T , T C J STG Notes: 5. For a device surface mounted on 25mm x 25mm FR-4 PCB with high coverage of single sided 1oz copper, in still air conditions. 6. For a device surface mounted on FR-4 PCB measured at t 10 secs. 7. Repetitive rating 25mm x 25mm FR-4 PCB, D = 0.02, pulse width 300s - pulse width limited by maximum junction temperature. Thermal Characteristics 2 of 7 ZXMN2B03E6 March 2015 Diodes Incorporated www.diodes.com Datasheet Number: DS33521 Rev. 2 - 2 NEW PRODUCT