ZXMN3A01F 30V N-CHANNEL ENHANCEMENT MODE MOSFET Product Summary Features I D Low On-Resistance V R (BR)DSS DS(ON) TA = +25C Fast Switching Speed 30V 0.12 V = 10V 2.0A GS Low Threshold Low Gate Drive Description Small Surface Mount Package Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) This new generation MOSFET has been designed to minimize the on- Halogen and Antimony Free. Green Device (Note 3) state resistance (R ) and yet maintain superior switching DS(ON) Qualified to AEC-Q101 Standards for High Reliability performance, making it ideal for high efficiency power management applications. Mechanical Data Applications Case: SOT23 Case Material: Molded Plastic. UL Flammability Classification DC-DC Converters Rating 94V-0 Power Management Functions Moisture Sensitivity: Level 1 per J-STD-020 Motor Control e3 Terminals: Solderable per MIL-STD-202, Method 208 Lead Free Plating (Matte Tin Finish Annealed over Alloy 42 Leadframe) Terminal Connections: See Diagram Weight: 0.006 grams (Approximate) D D G G S S Top View Equivalent Circuit Pin Configuration Top View Ordering Information (Note 4) Part Number Case Packaging ZXMN3A01FTA SOT23 3,000/Tape & Reel ZXMN3A01FTC SOT23 10,000/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See ZXMN3A01F Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Units Drain-Source Voltage V 30 V DSS 20 Gate-Source Voltage V V GSS T = +25C (Note 6) A 2.0 (Note 6) 1.6 A Continuous Drain Current, V = 10V T = +70C I GS A D (Note 5) 1.8 T = +25C A Pulsed Drain Current (Note 7) I 8 A DM Maximum Body Diode Continuous Current (Note 6) I 1.3 A S Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Units Total Power Dissipation 625 mW (Note 5) P D Linear Derating Factor 5 mW/C Total Power Dissipation 806 mW (Note 6) P D Linear Derating Factor 6.4 mW/C (Note 5) 200 Thermal Resistance, Junction to Ambient C/W R JA (Note 6) 155 Operating and Storage Temperature Range T T -55 to +150 C J, STG Notes: 5. For a device surface mounted on 25mm x 25mm FR-4 PCB with high coverage of single sided 1oz copper, in still air conditions. 6. For a device surface mounted on FR-4 PCB measured at t 5 secs. 7. Repetitive rating 25mm x 25mm FR-4 PCB, D = 0.05, pulse width 10s - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph. 2 of 7 ZXMN3A01F January 2015 Diodes Incorporated www.diodes.com Document number: DS33528 Rev.4 - 2 ADVANCED INFORMATION