ZXMN3A03E6 30V N-CHANNEL ENHANCEMENT MODE MOSFET Product Summary Features and Benefits Low On-resistance Max I D V Max R (BR)DSS DS(ON) Fast Switching Speed T = +25C A Low Threshold 30V 0.050 V = 10V 4.6A GS Low Gate Drive Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Description and Applications This new generation of TRENCH MOSFET from Zetex utilizes a unique structure that combines the benefits of low on-resistance with Mechanical Data fast switching speed. This makes them ideal for high efficiency, low voltage, power management applications. Case: SOT26 DC - DC converters Case Material: Molded Plastic, Green Molding Compound. Power Management Functions UL Flammability Classification Rating 94V-0 Disconnect Switches Moisture Sensitivity: Level 1 per J-STD-020 Motor Control Terminals: Finish Matte Tin Annealed over Copper Leadframe. Solderable per MIL-STD-202, Method 208 Weight: 0.015 grams (Approximate) SOT26 Top View Pinout Top-view Device Symbol Ordering Information (Note 4) Part Number Reel Size (inch) Tape Width (mm) Quantity Per Reel ZXMN3A03E6TA 7 8 3000 ZXMN3A03E6TC 13 8 10,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See ZXMN3A03E6 Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Drain-Source Voltage V 30 V DSS Gate-Source Voltage 20 V VGS 4.6 T = +25C (Note 6) A Continuous Drain Current 3.7 A V = 10V T = +70C (Note 6) I GS A D 3.7 T = +25C (Note 5) A Pulsed Drain Current (Note 7) 17 A I DM Continuous Source Current (Body Diode) (Note 6) I 2.6 A S Pulsed Source Current (Body Diode) (Note 7) I 17 A SM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit 1.1 W Power Dissipation at TA = +25C (Note 5) PD 8.8 Linear derating factor (Note 5) mW/C 1.7 W Power Dissipation at T = +25C (Note 6) P A D 13.6 Linear derating factor (Note 6) mW/C Junction to Ambient (Note 5) 113 R C/W JA Junction to Ambient (Note 6) 73 R C/W JA Operating and Storage Temperature Range T , T -55 to +150 C J STG Notes: 5. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. 6. For a device surface mounted on FR-4 PCB measured at t 10 secs. 7. Repetitive rating 25mm x 25mm FR-4 PCB, D = 0.05, pulse width 10s - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph. Thermal Characteristics 2 of 7 ZXMN3A03E6 March 2015 Diodes Incorporated www.diodes.com Datasheet Number: DS33531 Rev. 4 - 2 NEW PRODUCT