ZXMP10A13FQTA Diodes Incorporated

ZXMP10A13F 100V P-CHANNEL ENHANCEMENT MODE MOSFET Product Summary Features Fast Switching Speed Max I D BV Max R Package DSS DS(ON) T = +25C Low Input Capacitance A Low Gate Charge 1 V = -10V -0.7A GS -100V SOT23 Low Threshold -0.5A 1.45 V = -6.0V GS Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Description Qualified to AEC-Q101 Standards for High Reliability An Automotive-Compliant Part is Available Under Separate This MOSFET utilizes a unique structure that combines the benefits Data Sheet (ZXMP10A13FQ) of low on-resistance with fast switching speed, making it ideal for high-efficiency power management applications. Mechanical Data Applications Case: SOT23 DC-DC Converters Case Material: Molded Plastic, UL Flammability Classification Power Management Functions Rating 94V-0 Disconnect Switches Moisture Sensitivity: Level 1 per J-STD-020 Motor Control Terminals: Matte Tin Finish Annealed over Copper Leadframe Solderable per MIL-STD-202, Method 208 Weight: 0.009 grams (Approximate) D SOT23 S G D G S Top View Top View Equivalent Circuit Pin Out Ordering Information (Note 4) Part Number Case Packaging ZXMP10A13FTA SOT23 3,000/Tape & Reel ZXMP10A13FTC SOT23 10,000/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See ZXMP10A13F Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Units Drain-Source Voltage V -100 V DSS Gate-Source Voltage V 20 V GS (Note 6) -0.7 Continuous Drain Current V = 10V T = +70C (Note 6) I -0.5 A GS A D (Note 6) -0.6 Pulsed Drain Current (Note 7) -3.1 A I DM Continuous Source Current (Body Diode) (Note 5) I -1.1 A S Pulsed Source Current (Body Diode) (Note 7) I -3.1 A SM Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 5) 625 mW PD Linear Derating Factor 5 mW/C Power Dissipation (Note 6) 806 mW P D Linear Derating Factor 6.4 mW/C Thermal Resistance, Junction to Ambient (Note 5) R 200 C/W JA Thermal Resistance, Junction to Ambient (Note 6) R 155 C/W JA Thermal Resistance, Junction to Leads (Note 8) 194 C/W RJL Operating and Storage Temperature Range -55 to +150 C T T J, STG Notes: 5. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. 6. For a device surface mounted on FR4 PCB measured at t 5 secs. 7. Repetitive rating 25mm x 25mm FR4 PCB, D=0.05 pulse width=10s - pulse current limited by maximum junction temperature. 8. Thermal resistance from junction to solder-point (at the end of the drain lead). 2 of 8 ZXMP10A13F June 2016 Diodes Incorporated www.diodes.com Document number: DS33596 Rev. 5 - 2