ZXMP3A13F 30V P-CHANNEL ENHANCEMENT MODE MOSFET Product Summary Features Low On-Resistance Max I D V Max R Package (BR)DSS DS(ON) T = +25C A Fast Switching Speed Low Threshold 0.21 V = -10V -1.6A GS Low Gate Drive -30V SOT23 -1.1A 0.33 V = -4.5V GS Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Description Mechanical Data This new generation of trench MOSFETs utilizes a unique structure Case: SOT23 that combines the benefits of low on-resistance with fast switching Case Material: Molded Plastic, UL Flammability Classification speed. This makes them ideal for high efficiency, low voltage, and Rating 94V-0 power management applications. Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Matte Tin Finish Annealed over Copper Leadframe Solderable per MIL-STD-202, Method 208 Applications Weight: 0.008 grams (Approximate) DC-DC Converters Power Management Functions Disconnect Switches Motor Control SOT23 D S G D G S Top View Top View Equivalent Circuit Pin Out Ordering Information (Note 4) Part Number Compliance Case Quantity per Reel ZXMP3A13FTA Standard SOT23 3,000 ZXMP3A13FTC Standard SOT23 10,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See ZXMP3A13F Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Units Drain-Source Voltage -30 V VDSS Gate-Source Voltage 20 V V GS (Note 6) -1.6 Continuous Drain Current -1.3 A V = 10V T = +70C (Note 6) I GS A D (Note 5) -1.4 Pulsed Drain Current (Note 7) I -6 A DM Continuous Source Current (Body Diode) (Note 6) I -1.2 A S Pulsed Source Current (Body Diode) (Note 7) I -6 A SM Thermal Characteristics Characteristic Symbol Value Unit Power Dissipation (Note 5) P 625 mW D Linear Derating Factor 5 mW/C Power Dissipation (Note 6) P 806 mW D Linear Derating Factor 6.4 mW/C Thermal Resistance, Junction to Ambient (Note 5) 200 C/W R JA Thermal Resistance, Junction to Ambient (Note 6) 155 C/W R JA Operating and Storage Temperature Range -55 to +150 C T T J, STG Notes: 5. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions 6. For a device surface mounted on FR4 PCB measured at t 5 secs. 7. Repetitive rating 25mm x 25mm FR4 PCB, D=0.05 pulse width=10s - pulse current limited by maximum junction temperature. 2 of 8 ZXMP3A13F October 2015 Diodes Incorporated www.diodes.com Document number: DS33573 Rev. 2 - 2