A Product Line of Diodes Incorporated ZXTN04120HK 120V NPN MEDIUM POWER DARLINGTON TRANSISTOR IN TO252 Features Mechanical Data Case: TO252 (DPAK) BV > 120V CEO Case Material: Molded Plastic,Gree Molding Compound. BV > 140V CBO UL Flammability Classification Rating 94V-0 I = 1.5A High Continuous current C Moisture Sensitivity: Level 1 per J-STD-020 hFE > 2k for High Gain 1A Terminals: Finish - Matte Tin Plated Leads Solderable Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) per MIL-STD-202, Method 208 Weight: 0.34 grams (approximate) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Applications DC Fans Regulator Transistors Relays Solenoid Driving C C TO252 (DPAK) B C BE Top View Top View E Pin-Out Equivalent Circuit Ordering Information (Note 4) Product Package Marking Reel size (inches) Tape width (mm) Quantity per reel ZXTN04120HKTC TO252 (DPAK) ZXTN04120H 13 16 2,500 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See A Product Line of Diodes Incorporated ZXTN04120HK Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V 140 V CBO Collector-Emitter Voltage V 120 V CEO Emitter-Base Voltage V 14 V EBO Continuous Collector Current I 1.5 A C Peak Pulse Current 4 A I CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 3.9 Power Dissipation (Note 6) P 2 W D (Note 7) 1.5 (Note 5) 32 Thermal Resistance, Junction to Ambient Air (Note 6) R 62.5 JA (Note 7) 80 C/W Thermal Resistance, Junction to Leads (Note 8) 9 R JL Thermal Resistance, Junction to Case (Note 9) 11 R JC Operating and Storage Temperature Range -55 to +150 C T , T J STG ESD Ratings (Note 10) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the exposed collector pad on 50mm x 50mm 2oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as note (5), except mounted on 25mm x 25mm 1oz copper. 7. Same as note (5), except mounted on minimum recommended pad (MRP) layout. 8. Thermal resistance from junction to solder-point (on the exposed collector pad). 9. Thermal resistance from junction to the top of the case. 10. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 January 2014 ZXTN04120HK Diodes Incorporated www.diodes.com Document number: DS36554 Rev. 3 - 2