ZXTN19100CZTA Diodes Incorporated

ZXTN19100CZ 100V NPN medium power transistor in SOT89 Summary BV > 200V CEX BV > 100V CEO BV > 5V ECO I = 5.25A C(cont) V < 65mV 1A CE(sat) R = 44m CE(sat) P = 2.4W D Complementary part number ZXTP19100CZ Description C Packaged in the SOT89 outline this new low saturation NPN transistor offers extremely low on state losses making it ideal for use in DC-DC circuits and various driving and power management functions. B Features Higher power dissipation SOT89 package E High peak current Low saturation voltage High forward blocking voltage Applications E PSU start up switch Motor drive C C Lamp, relay and solenoid switches B Ordering information Pinout - top view Device Reel size Tape width Quantity (inches) (mm) per reel ZXTN19100CZTA 7 12 1000 Device marking 1L9 Issue 1 - February 2008 1 www.zetex.com Zetex Semiconductors plc 2008ZXTN19100CZ Absolute maximum ratings Parameter Symbol Limit Unit Collector-Base voltage V 200 V CBO Collector-Emitter voltage (forward blocking) V 200 V CEX Collector-Emitter voltage V 100 V CEO Emitter-Collector voltage (reverse blocking) V 6V ECX Emitter-Base voltage V 7V EBO (c) I 5.25 A Continuous Collector current C Base current I 1A B Peak pulse current I 10 A CM (a) P 1.1 W Power dissipation at T =25C D A 8.8 mW/C Linear derating factor (b) P 1.8 W Power dissipation at T =25C D A 14.4 mW/C Linear derating factor (c) P 2.4 W Power dissipation at T =25C D A 19.2 mW/C Linear derating factor (d) P 4.46 W Power dissipation at T =25C D A 35.7 mW/C Linear derating factor (e) P 26.6 W Power dissipation at T =25C D C 213 mW/C Linear derating factor Operating and storage temperature range T , T -55 to 150 C j stg Thermal resistance Parameter Symbol Limit Unit (a) R 117 C/W Junction to ambient JA (b) R 68 C/W Junction to ambient JA (c) R 51 C/W Junction to ambient JA (d) R 28 C/W Junction to ambient JA (e) R 4.69 C/W Junction to case JC NOTES: (a) For a device surface mounted on 15mm x 15mm x 0.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (b) Mounted on 25mm x 25mm x 0.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (c) Mounted on 50mm x 50mm x 0.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions. (d) As (c) above measured at t<5 seconds. (e) Junction to case (collector tab). Typical. Issue 1 - February 2008 2 www.zetex.com Zetex Semiconductors plc 2008