A Product Line of Diodes Incorporated Green ZXTN2005G 25V NPN LOW SATURATION TRANSISTOR IN SOT223 Features Mechanical Data BV > 60V Case: SOT223 CEO I = 7A Continuous Collector Current Case Material: Molded Plastic. Green Molding Compound C I = 20A Peak Pulse Current UL Flammability Rating 94V-0 CM Low Saturation Voltage V < 50mV max 1A Moisture Sensitivity: Level 1 per J-STD-020 CE(sat) R = 30m 6.5A for Low Equivalent On-Resistance Terminals: Finish - Matte Tin Plated Leads Solderable per SAT MIL-STD-202, Method 208 h Specified up to 20A for High Gain Hold-Up FE Lead-Free Finish RoHS Compliant (Notes 1 & 2) Weight: 0.112 grams (Approximate) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Applications DC-DC Converters MOSFET Gate Drivers Charging Circuits Power Switches Motor Control SOT223 Device Schematic Top View Pin-Out Top View Ordering Information (Note 4) Part Number Marking Reel size (inches) Tape width (mm) Quantity per reel ZXTN2005GTA ZXTN2005 7 12 1,000 Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See A Product Line of Diodes Incorporated ZXTN2005G Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage 60 V VCBO Collector-Emitter Voltage 25 V V CEO Emitter-Base Voltage 7 V V EBO Continuous Collector Current 7 A I C Peak Pulse Current 20 A I CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit 3.0 (Note 5) Power Dissipation 24 W P D Linear Derating Factor mW/C 1.6 (Note 6) 12.8 (Note 5) 42 R JA Thermal Resistance, Junction to Ambient (Note 6) R 78 C/W JA Thermal Resistance, Junction to Lead (Note 7) 8.8 R JL Operating and Storage Temperature Range T T -55 to +150 C J, STG ESD Ratings (Note 8) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 8,000 V 3B Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the collector lead on 52mm x 52mm 2oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in steady-state. 6. Same as Note 5, except the device is mounted on 25mm x 25mm 1oz copper. 7. Thermal resistance from junction to solder-point (at the end of the collector lead). 8. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 ZXTN2005G May 2015 Diodes Incorporated www.diodes.com Document number: DS33655 Rev. 5 - 2