ZXTN25020DFHTA Diodes Incorporated

ZXTN25020DFH 20V SOT23 NPN medium power transistor Summary BV > 100V BV > 20V CEX (BR)CEO BV > 5V ECO I = 4.5A C(CONT) R = 28 m typical CE(sat) V < 43 mV 1A CE(sat) P = 1.25W D Complementary part number ZXTP25020DFH Description C Advanced process capability and package design have been used to maximize the power handling and performance of this small outline transistor. The compact size and ratings of this device make it ideally B suited to applications where space is at a premium. Features E Higher power dissipation SOT23 package High peak current Low saturation voltage 100V forward blocking voltage 5V reverse blocking voltage Applications E DC - DC converters MOSFET and IGBT gate driving C LED driver B Motor drive Relay, lamp and solenoid drive Pinout - top view Ordering information Device Reel size Tape width Quantity per reel (inches) ZXTN25020DFHTA 7 8mm 3000 Device marking 016 Issue 2 - May 2006 1 www.zetex.com Zetex Semiconductors plc 2006ZXTN25020DFH Absolute maximum ratings Parameter Symbol Limit Unit Collector-base voltage V 100 V CBO Collector-emitter voltage (forward blocking) V 100 V CEX Collector-emitter voltage V 20 V CEO Emitter-collector voltage (reverse blocking) V 5V ECO Emitter-base voltage V 7V EBO (c) I 4.5 A Continuous collector current C Base current I 1A B Peak pulse current I 15 A CM (a) P 0.73 W Power dissipation at T =25C D A Linear derating factor 5.84 mW/C (b) P 1.05 W Power dissipation at T =25C D A Linear derating factor 8.4 mW/C (c) P 1.25 W Power dissipation at T =25C D A Linear derating factor 9.6 mW/C (d) P 1.81 W Power dissipation at T =25C D A Linear derating factor 14.5 mW/C Operating and storage temperature range T , T - 55 to 150 C j stg Thermal resistance Parameter Symbol Limit Unit (a) R 171 C/W Junction to ambient JA (b) R 119 C/W JA Junction to ambient (c) R 100 C/W Junction to ambient JA (d) R 69 C/W Junction to ambient JA NOTES: (a) For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (b) Mounted on 25mm x 25mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions. (c) Mounted on 50mm x 50mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions. (d) As (c) above measured at t<5secs. Issue 2 - May 2006 2 www.zetex.com Zetex Semiconductors plc 2006