ZXTP 03 200BG Green 200V PNP MEDIUM POWER LOW SATURATION TRANSISTOR IN SOT223 Features Mechanical Data BV > -200V Case: SOT223 CEO I = -2A High Continuous Collector Current C Case Material: Molded Plastic. Green Molding Compound I = -5A Peak Pulse Current CM UL Flammability Rating 94V-0 Low Saturation Voltage V < -160mV I = -1A CE(sat) C Moisture Sensitivity: Level 1 per J-STD-020 R = 135m for a Low Equivalent On-Resistance SAT Terminals: Finish - Matte Tin Plated Leads, Solderable per Enhanced Switching Performance MIL-STD-202, Method 208 Lead-Free Finish RoHS Compliant (Notes 1 & 2) Weight: 0.112 grams (Approximate) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Applications DC-DC Conversion C SOT223 B E Top View Top View Device Symbol Pin-Out Ordering Information (Note 4) Product Marking Reel size (inches) Tape width (mm) Quantity per reel ZXTP03200BGTA ZXTP03200B 7 12 1,000 Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See ZXTP 03200BG Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V -220 V CBO Collector-Emitter Voltage V -200 V CEO Emitter-Base Voltage V -7 V EBO Continuous Collector Current -2 A IC Peak Pulse Current -5 A I CM Base Current -1 A I B Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 1.25 (Note 6) 1.65 Power Dissipation W PD (Note 7) 3.0 (Note 8) 5.8 (Note 5) 100 (Note 6) 76 Thermal Resistance, Junction to Ambient R JA (Note 7) 41.6 C/W (Note 8) 21.5 Thermal Resistance, Junction to Lead (Note 9) R 10.5 JL Operating and Storage Temperature Range -55 to +150 C T T J, STG ESD Ratings (Note 10) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the collector lead on 15mm x 15mm 1oz. copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as Note 5, except the device is mounted on 25mm x 25mm 1oz. copper. 7. Same as Note 5, except the device is mounted on 50mm x 50mm 2oz. copper. 8. Same as Note 7, except measured at t<5 seconds. 9. Thermal resistance from junction to solder-point (at the end of the collector lead). 10. Refer to JEDEC specification JESD22-A114 and JESD22-A115. ZXTP03200BG 2 of 7 December 2015 Diodes Incorporated Datasheet Number: DS33722 Rev. 2 - 2 www.diodes.com