ZXTP2012Z
Green
60V PNP LOW SATURATION MEDIUM POWER TRANSISTOR IN SOT89
Features Mechanical Data
BV > -60V Case: SOT89
CEO
I = -4.3A High Continuous Current
C Case Material: Molded Plastic. Green Molding Compound. UL
R = 32m for a Low Equivalent On-Resistance
SAT Flammability Rating 94V-0
Low Saturation Voltage V < -65mV @ I = -1A
CE(SAT) C
Moisture Sensitivity: Level 1 per J-STD-020
h Specified Up to -10A for High Current Gain Hold Up
FE
Terminals: Finish - Matte Tin Plated Leads, Solderable per
Complementary NPN Type: ZXTN2010Z
MIL-STD-202, Method 208
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Weight: 0.05 grams (Approximate)
Halogen and Antimony Free. Green Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
PPAP Capable (Note 4)
Application
Emergency Lighting Circuits
Motor Driving (Including DC Fans)
Backlight Inverters
Power Switches
Gate Driving MOSFETs and IGBTs
SOT89
C
E
C C
B
B
E
Top View
Top View Device Symbol
Pin Out
Ordering Information (Note 5)
Part Number Compliance Marking Reel Size (inches) Tape Width (mm) Quantity Per Reel
ZXTP2012ZTA AEC-Q101 951 7 12 1,000
ZXTP2012Z-13R AEC-Q101 951 13 12 4,000
ZXTP2012ZQTA Automotive 951 7 12 1,000
Notes: 1. EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. All applicable RoHS exemptions applied.
2. See
ZXTP2012Z
Maximum Ratings (@T = +25C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Collector-Base Voltage -100 V
V
CBO
Collector-Emitter Voltage -60 V
V
CEO
Emitter-Base Voltage V -7 V
EBO
Base Current I -2 A
B
Continuous Collector Current I -4.3 A
C
Peak Pulse Current I -15 A
CM
Thermal Characteristics (@T = +25C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Power Dissipation (Note 6) 1.5 W
P
D
Linear Derating Factor 12 mW/C
Power Dissipation (Note 7) 2.1 W
PD
Linear Derating Factor 16.8 mW/C
Thermal Resistance, Junction to Ambient (Note 6) 83 C/W
R
JA
Thermal Resistance, Junction to Ambient (Note 7) 60
R C/W
JA
Thermal Resistance, Junction to Leads (Note 8) 3.23
R C/W
JL
Operating and Storage Temperature Range -55 to +150
T T C
J, STG
Notes: 6. For a device surface mounted on 25mm x 25mm x 1.6mm FR-4 PCB with high coverage of single sided 1oz copper, in still air conditions; device
measured when operating in steady state condition.
7. Same as note (6), except the device is mounted on 50mm x 50mm single sided 1oz weight copper.
8. Thermal resistance from junction to solder-point (on the exposed collector pad).
2 of 7
ZXTP2012Z September 2018
Diodes Incorporated
www.diodes.com
Document number: DS33713 Rev. 5 - 2