A Product Line of Diodes Incorporated Green ZXTP2014G 140V PNP MEDIUM POWER LOW SATURATION TRANSISTOR IN SOT223 Features Mechanical Data BV > -140V Case: SOT223 CEO I = -4A High Continuous Collector Current Case Material: Molded Plastic. Green Molding Compound C I = -10A Peak Pulse Current UL Flammability Rating 94V-0 CM Low Saturation Voltage V < -120mV I = -1A Moisture Sensitivity: Level 1 per J-STD-020 CE(sat) C R = 92m for a Low Equivalent On-Resistance Terminals: Finish - Matte Tin Plated Leads Solderable per MIL- SAT h Specified up to -10A for a High Gain Hold-Up STD-202, Method 208 FE Lead-Free Finish RoHS Compliant (Notes 1 & 2) Weight: 0.112 grams (Approximate) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability C SOT223 B E Top View Top View Device Symbol Pin-Out Ordering Information (Note 4) Product Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel ZXTP2014GTA AEC-Q101 ZXTP2014 7 12 1,000 ZXTP2014GTC AEC-Q101 ZXTP2014 13 12 4,000 Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See A Product Line of Diodes Incorporated ZXTP2014G Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V -180 V CBO Collector-Emitter Voltage V -140 V CEO Emitter-Base Voltage V -7 V EBO Continuous Collector Current -4 A IC Peak Pulse Current -10 A I CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 3.0 (Note 6) 2.0 Power Dissipation P W D (Note 7) 1.6 (Note 8) 1.2 (Note 5) 41.7 (Note 6) 62.5 Thermal Resistance, Junction to Ambient R JA (Note 7) 78.1 C/W (Note 8) 104 Thermal Resistance Junction to Lead (Note 9) 10.5 R JL Operating and Storage Temperature Range T T -55 to +150 C J, STG ESD Ratings (Note 9) Characteristic Symbol Value Unit JEDEC Class 3B Electrostatic Discharge - Human Body Model ESD HBM 8,000 V C Electrostatic Discharge - Machine Model ESD MM 400 V Notes: 5. For a device mounted with the collector lead on 52mm x 52mm 2oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as Note 5, except the device is mounted on 25mm x 25mm 2oz copper. 7. Same as Note 5, except the device is mounted on 25mm x 25mm 1oz copper. 8. Same as Note 5, except the device is mounted on minimum recommended pad layout. 9. Thermal resistance from junction to solder-point (at the end of the collector lead). 10. Refer to JEDEC specification JESD22-A114 and JESD22-A115. ZXTP2014G 2 of 7 May 2015 Diodes Incorporated Datasheet Number: DS33716 Rev. 3 - 2 www.diodes.com