ZXTP2041FTA Diodes Incorporated

A Product Line of Diodes Incorporated ZXTP2041F 40V PNP MEDIUM POWER TRANSISTOR IN SOT23 Features Mechanical Data BV > -40V Case: SOT23 CEO I = -1A High Continuous Current Case Material: Molded Plastic, Green Molding Compound C I = -2A Peak Pulse Current UL Flammability Classification Rating 94V-0 CM Low Saturation Voltage V < -500mV -1A Moisture Sensitivity: Level 1 per J-STD-020 CE(sat) R = 350m for a Low Equivalent On-resistance Terminals: Finish Matte Tin Plated Leads, Solderable per SAT Complementary NPN type: ZXTN2040F MIL-STD-202, Method 208 Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) Weight: 0.008 grams (approximate) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Application Power MOSFET gate driving Low loss power switching SOT23 C E C B B E Top View Device symbol Top View Pin-Out Ordering Information (Note 4) Product Marking Reel size (inches) Tape width (mm) Quantity per reel ZXTP2041FTA P41 7 8 3,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See A Product Line of Diodes Incorporated ZXTP2041F Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V -40 V CBO Collector-Emitter Voltage V -40 V CEO Emitter-Base Voltage -7 V V EBO Continuous Collector Current -1 A I C Peak Pulse Current -2 A I CM Base Current I -200 mA B Peak Base Current I -1 A BM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 310 Power Dissipation P mW D (Note 6) 350 (Note 5) 403 Thermal Resistance, Junction to Ambient R C/W JA (Note 6) 357 Thermal Resistance, Junction to Leads (Note 7) R 350 C/W JL Operating and Storage Temperature Range T T -55 to +150 C J, STG ESD Ratings (Note 8) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device mounted on minimum recommended pad layout 1oz copper that is on a single-sided FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as note (5), except the device is mounted on 15 mm x 15mm 1oz copper. 7. Thermal resistance from junction to solder-point (at the end of the leads). 8. Refer to JEDEC specification JESD22-A114 and JESD22-A115. ZXTP2041F 2 of 7 December 2013 Diodes Incorporated Datasheet Number: DS33721 Rev. 7 - 2 www.diodes.com