A Product Line of Diodes Incorporated ZXTP25060BFH 60V PNP MEDIUM POWER TRANSISTOR IN SOT23 Features and Benefits Mechanical Data BV > -60V Breakdown Voltage Case: SOT23 CEO 100V forward blocking voltage Case material: molded Plastic. Green molding Compound. I = -3A Continuous Collector Current, UL Flammability Rating 94V-0 C I = -9A Peak Pulse Current, Moisture Sensitivity: Level 1 per J-STD-020 CM Low saturation voltage, V < -85mV -1A Terminals: Matte Tin Finish CE(sat) R = 58 m for a low equivalent on-resistance Weight: 0.008 grams (Approximate) CE(sat) 1.25W power dissipation using SuperSOT package Complementary part number ZXTN25060BFH Applications Lead Free, RoHS Compliant (Note 1) MOSFET drivers Halogen and Antimony Free, Green Device (Note 2) Power switches Qualified to AEC-Q101 Standards for High Reliability Motor control C SOT23 C B B E E Top View Top View Device Symbol Pin-Out Ordering Information (Note 3) Product Case Reel size (inches) Tape width (mm) Quantity per reel ZXTP25060BFHTA SOT23 7 8mm 3000 Notes: 1. No purposefully added lead. 2. Diodes Inc.s Green Policy can be found on our website at A Product Line of Diodes Incorporated ZXTP25060BFH Maximum Ratings T = 25C unless otherwise specified A Characteristic Symbol Value Unit Collector-Base Voltage V -100 V CBO Collector-Emitter Voltage (forward blocking) V -100 V CEX Collector-Emitter Voltage V -60 V CEO V Emitter-Collector Voltage (reverse blocking) ECO -7 V Emitter-Base Voltage V -7 V EBO Continuous Collector Current I -3 A C Peak pulse Current I -9 A CM Thermal Characteristics T = 25C unless otherwise specified A Characteristic Symbol Value Unit 0.73 (Note 4) 5.84 1.05 (Note 5) 8.4 Power Dissipation P W D Linear derating factor 1.25 (Note 6) 9.6 1.81 (Note 7) 14.5 (Note 4) 171 (Note 5) 119 Thermal Resistance, Junction to Ambient R C/W JA (Note 6) 100 (Note 7) 69 R Thermal Resistance, Junction to Lead (Note 8) JL 74.95 C/W Operating and Storage Temperature Range T T -55 to +150 C J, STG Notes: 4. For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions the device is measured when operating in a steady-state condition. 5. Same as note (4), except the device is surface mounted on 25mm x 25mm with 2 oz copper. 6. Same as note (4), except the device is surface mounted on 50mm x 50mm with 2 oz copper. 7. Same as note (6), except the device is measured at t<5secs. 8. Thermal resistance from junction to solder-point (at the end of the collector lead). 2 of 7 January 2012 ZXTP25060BFH Diodes Incorporated www.diodes.com Document number: DS33374 Rev. 4 - 2