ZXTP25100BFH Diodes Incorporated

ZXTP25100BFH 100V, SOT23, PNP medium power transistor Summary BV > -140V, BV > -100V (BR)CEX (BR)CEO BV > -7V (BR)ECX I = -2A C(cont) V < -130mV -1A CE(sat) R = 108m typical CE(sat) P = 1.25W D Complementary part number ZXTN25100BFH Description C Advanced process capability and package design have been used to maximize the power handling and performance of this small outline transistor. The compact size and ratings of this device make it ideally B suited to applications where space is at a premium. Features High power dissipation SOT23 package E High peak current Low saturation voltage 140V forward blocking voltaget 7V reverse blocking voltage Applications MOSFET and IGBT gate driving DC - DC converters Pinout - top view Motor drive Relay, lamp, and solenoid drive Ordering information Device Reel size Tape width Quantity per reel (inches) ZXTP25100BFHTA 7 8mm 3,000 Device marking 056 Issue 1 - March 2006 1 www.zetex.com Zetex Semiconductors plc 2006ZXTP25100BFH Absolute maximum ratings Parameter Symbol Limit Unit Collector-base voltage V -140 V CBO Collector-emitter voltage (forward blocking) V -140 V CEX Collector-emitter voltage V -100 V CEO Emitter-collector voltage (reverse blocking) V -7 V ECX Emitter-base voltage V -7 V EBO (b) I -2 A Continuous collector current C Peak pulse current I -5 A CM (a) P 0.73 W Power dissipation at T =25C D A 5.84 mW/C Linear derating factor (b) P 1.05 W Power dissipation at T =25C D A 8.4 mW/C Linear derating factor (c) P 1.25 W Power dissipation at T =25C D A 9.6 mW/C Linear derating factor (d) P 1.81 W Power dissipation at T =25C D A 14.5 mW/C Linear derating factor Operating and storage temperature range T , T -55 to 150 C j stg Thermal resistance Parameter Symbol Limit Unit (a) R 171 C/W Junction to ambient JA (b) R 119 C/W Junction to ambient JA (c) R 100 C/W Junction to ambient JA (d) R 69 C/W Junction to ambient JA NOTES: (a) For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (b) Mounted on 25mm x 25mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions. (c) Mounted on 50mm x 50mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions. (d) As (c) above measured at t<5secs. Issue 1 - March 2006 2 www.zetex.com Zetex Semiconductors plc 2006