ZXTP25100CZ 100V PNP MEDIUM POWER TRANSISTOR IN SOT89 Features Mechanical Data BV > -100V CEO Case: SOT89 BV > -7V ECO Case Material: Molded Plastic. Green Molding Compound. I = -1A Continuous Collector Current C UL Flammability Rating 94V-0 I = -3A Peak Collector Current CM Moisture Sensitivity: Level 1 per J-STD-020 V < -225mV -1A CE(SAT) Terminals: Finish Matte Tin Plated Leads. Solderable per R = 155m for a Low Equivalent On-Resistance CE(SAT) MIL-STD-202, Method 208 Complementary NPN Type: ZXTN25100DZ Weight: 0.05 grams (Approximate) Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability SOT89 C E B C C B E Top View Top View Device Symbol Pin Out Ordering Information (Note 4) Product Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel ZXTP25100CZTA AEC-Q101 1L7 7 12 1,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See ZXTP25100CZ Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Limit Unit Collector-Base Voltage V -115 V CBO Collector-Emitter Voltage V -100 V CEO Emitter-Collector Voltage (Reverse Blocking) -7 V V ECO Emitter-Base Voltage -7 V V EBO Continuous Collector Current -1 A I C Peak Pulse Current -3 A I CM Base Current I -500 mA B Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit 1.1 (Note 5) 8.8 1.8 (Note 6) Power Dissipation 14.4 W P D Linear Derating Factor mW/C 2.4 (Note 7) 19.2 4.46 (Note 8) 35.7 (Note 5) 117 (Note 6) 68 Thermal Resistance, Junction to Ambient Air R JA (Note 7) 51 C/W (Note 8) 28 Thermal Resistance, Junction to Lead (Note 9) R 7.95 JL Operating and Storage Temperature Range T T -55 to +150 C J, STG ESD Ratings (Note 10) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the exposed collector pad on 15mm x 15mm 1oz copper that is on a single-sided 0.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as Note 5, except the device is mounted on 25mm x 25mm 2oz copper. 7. Same as Note 5, except the device is mounted on 50mm x 50mm 2oz copper. 8. Same as Note 7, except the device is measured at t<5 seconds. 9. Thermal resistance from junction to solder-point (on the exposed collector pad). 10. Refer to JEDEC specification JESD22-A114 and JESD22-A115. ZXTP25100CZ 2 of 8 April 2016 Diodes Incorporated Datasheet Number: DS33759 Rev. 2 - 2 www.diodes.com