ZXTP718MATA Diodes Incorporated

A Product Line of Diodes Incorporated ZXTP718MA 20V PNP LOW SATURATION SWITCHING TRANSISTOR Features and Benefits Mechanical Data BV > -20V Case: DFN2020B-3 CEO I = -3.5A Continuous Collector Current Case Material: Molded Plastic. Green Molding Compound. C Low Saturation Voltage (-220mV max -1A) Terminals: Pre-Plated NiPdAu leadframe. R = 64 m for a low equivalent On-Resistance SAT Nominal Package Height: 0.6mm h specified up to -6A for high current gain hold up FE UL Flammability Rating 94V-0 Low profile 0.6mm high package for thin applications Moisture Sensitivity: Level 1 per J-STD-020 R efficient, 60% lower than SOT23 JA Weight: 0.01 grams (approximate) 2 4mm footprint, 50% smaller than SOT23 Lead-Free, RoHS Compliant (Note 1) Halogen and Antimony Free.Gree Device (Note 2) Applications Qualified to AEC-Q101 Standards for High Reliability MOSFET Gate Driving DC-DC Converters Charging Circuits Power switches Motor control C DFN2020B-3 B E Bottom View Device Symbol Top View Bottom View Pin-Out Ordering Information (Note 3) Product Marking Reel size (inches) Tape width (mm) Quantity per reel ZXTP718MATA S2 7 8 3000 ZXTP718MATC S2 13 8 10000 Notes: 1. No purposefully added lead. 2. Diodes Inc sGree policy can be found on our website at A Product Line of Diodes Incorporated ZXTP718MA Maximum Ratings T = 25C unless otherwise specified A Characteristic Symbol Value Unit Collector-Base Voltage V -25 CBO Collector-Emitter Voltage V -20 V CEO Emitter-Base Voltage V -7 EBO Peak Pulse Current I -6 CM (Note 4) -3.5 Continuous Collector Current I A C (Note 5) -4.0 Base Current I -1 B Thermal Characteristics T = 25C unless otherwise specified A Characteristic Symbol Value Unit 1.5 (Note 4) 12 Power Dissipation W P D Linear Derating Factor 2.45 mW/C (Note 5) 19.6 (Note 4) 83 Thermal Resistance, Junction to Ambient R JA (Note 5) 51 C/W Thermal Resistance, Junction to Lead (Note 6) 16.8 R JL Operating and Storage Temperature Range T T -55 to +150 C J, STG 2 Notes: 4. For a device surface mounted on 31mm x 31mm (10cm ) FR4 PCB with high coverage of single sided 1oz copper, in still air conditions the device is measured when operating in a steady-state condition. The entire exposed collector pad is attached to the heatsink. 5. Same as note (3), except the device is measured at t 5 sec. 6. For a single device, thermal resistance from junction to solder-point (at the end of the drain lead). 2 of 7 January 2011 ZXTP718MA Diodes Incorporated www.diodes.com Document Number DS31939 Rev. 5 - 2