A Product Line of Diodes Incorporated ZXTP722MA 70V PNP LOW SATURATION TRANSISTOR Features and Benefits Mechanical Data Case: DFN2020B-3 BV > -70V CEO I = -2.5A Continuous Collector Current Case material: Molded Plastic. Green Molding Compound. C Low Saturation Voltage (-220mV max -1A) Terminals: Pre-Plated NiPdAu leadframe. R = 117 m for a low equivalent On-Resistance SAT Nominal package height: 0.6mm h specified up to -3A for high current gain hold up UL Flammability Rating 94V-0 FE Low profile 0.6mm high package for thin applications Moisture Sensitivity: Level 1 per J-STD-020 R efficient, 60% lower than SOT23 JA Weight: 0.01 grams (approximate) 2 4mm footprint, 50% smaller than SOT23 Lead-Free, RoHS Compliant (Note 1) Halogen and Antimony Free.Gree Device (Note 2) Applications Qualified to AEC-Q101 Standards for High Reliability MOSFET Gate Driving DC-DC Converters Charging Circuits Power switches Motor control C DFN2020B-3 B E Bottom View Device Symbol Top View Bottom View Pin-Out Ordering Information Product Marking Reel size (inches) Tape width (mm) Quantity per reel ZXTP722MATA S4 7 8 3000 Notes: 1. No purposefully added lead. 2. Diodes Inc sGree policy can be found on our website at A Product Line of Diodes Incorporated ZXTP722MA Maximum Ratings T = 25C unless otherwise specified A Characteristic Symbol Value Unit Collector-Base Voltage V -70 CBO Collector-Emitter Voltage V -70 V CEO Emitter-Base Voltage V -7 EBO Peak Pulse Current I -3 CM (Note 3) -2.5 Continuous Collector Current A I C (Note 4) -2.7 Base Current I -1 B Thermal Characteristics T = 25C unless otherwise specified A Characteristic Symbol Value Unit 1.5 (Note 3) 12 W Power Dissipation P D Linear Derating Factor 2.45 mW/C (Note 4) 19.6 (Note 3) 83 Thermal Resistance, Junction to Ambient R JA (Note 4) 51 C/W Thermal Resistance, Junction to Lead (Note 5) 16.8 R JL Operating and Storage Temperature Range T T -55 to +150 C J, STG 2 Notes: 3. For a device surface mounted on 31mm x 31mm (10cm ) FR4 PCB with high coverage of single sided 1oz copper, in still air conditions the device is measured when operating in a steady-state condition. The entire exposed collector pad is attached to the heatsink. 4. Same as note (3), except the device is measured at t 5 sec. 5. For a single device, thermal resistance from junction to solder-point (at the end of the drain lead). 2 of 7 January 2011 ZXTP722MA Diodes Incorporated www.diodes.com Document Number DS31885 Rev. 5 - 2