ZXTP749F 25V PNP LOW SATURATION TRANSISTOR IN SOT23 Features Mechanical Data BV > -25V Case: SOT23 CEO BV > -35V forward blocking voltage CEO Case Material: Molded Plastic, Green Molding Compound I = -3A Continuous Collector Current C UL Flammability Classification Rating 94V-0 Low Saturation Voltage, V < -150mV -1A. CE(SAT) Moisture Sensitivity: Level 1 per J-STD-020 R = 87m for a low equivalent on-resistance CE(sat) Terminals: Finish Matte Tin Plated Leads 725mW power dissipation Solderable per MIL-STD-202, Method 208 h characterised up to -6A for high current gain hold-up FE Weight 0.008 grams (Approximate) Complementary NPN Type: ZXTN649F Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) Application Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability MOSFET Gate Drivers Power Switching in Automotive and Industrial Applications Motor Drive and Control SOT23 E C C B B E Top View Top View Device Symbol Pin-Out Ordering Information (Note 4) Product Marking Reel size (inches) Tape width (mm) Quantity per reel ZXTP749FTA 1N8 7 8 3,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See ZXTP749F Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage -35 V V CBO Collector-Emitter Voltage -25 V V CEO Emitter-Base Voltage -7 V V EBO Continuous Collector Current -3 A I C Peak Pulse Current I -6 A CM Base Current I -500 mA B Peak Pulse Current I -2 A BM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Power Dissipation (Note 5) 725 mW P D Thermal Resistance, Junction to Ambient (Note 5) 172 C/W R JA Thermal Resistance, Junction to Leads (Note 6) 79 C/W R JL Operating and Storage Temperature Range -55 to +150 C T T J, STG ESD Ratings (Note 7) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1 oz. copper, in still air conditions the device is measured when operating in a steady-state condition. 6. Thermal resistance from junction to solder-point (at the end of the collector lead). 7. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 ZXTP749F January 2016 Diodes Incorporated www.diodes.com Document Number: DS31901 Rev. 4 - 2