Effective August 2017 Technical Data 4128 Supersedes March 2007 SD3114 Low profile metalized shielded drum core power inductors Applications Mobile phones, Digital cameras Media players Small LCD displays LED driver and LED flash circuits Hard disk drives LCD Backlighting Environmental data SMD Device Storage temperature range (component): -40 C to +125 C Product features Operating temperature range: -40 C to +125 C 3.1 mm x 3.1 mm x 1.4 mm shielded drum core (ambient plus self-temperature rise) Ferrite core material Solder reflow temperature: Inductance range from 1.0 uH to 330 uH J-STD-020 (latest revision) compliant Current range from 2.59 A to 0.106 A HALOGEN Frequency range up to 4 MHz Pb HF FREESD3114 Technical Data 4128 Effective August 2017 Low profile metalized shielded drum core power inductors Product specifications Part Number Rated OCL (1) Part Irms (2) Isat (3) DCR () K-factor Inductance (H) Marking (A) (A) typ. (4) (H) Designator +20 C SD3114-1R0-R 1.0 1.16+/-30% A 1.60 2.35 0.058 98 SD3114-1R5-R 1.5 1.44+/-30% B 1.39 2.11 0.077 79 SD3114-2R2-R 2.2 2.12+/-30% C 1.17 1.74 0.110 67 SD3114-3R3-R 3.3 3.36+/-30% D 0.95 1.38 0.167 54 SD3114-4R7-R 4.7 4.90+/-30% E 0.77 1.14 0.251 45 SD3114-6R8-R 6.8 6.72+/-30% F 0.71 0.98 0.296 37 SD3114-8R2-R 8.2 8.10+/-30% G 0.68 0.89 0.329 34 SD3114-100-R 10.0 10.4+/-30% H 0.57 0.78 0.458 30 SD3114-150-R 15.0 14.9+/-20% I 0.48 0.66 0.650 25 SD3114-220-R 22.0 22.5+/-20% J 0.43 0.53 0.821 21 SD3114-330-R 33.0 33.1+/-20% K 0.35 0.44 1.23 17 SD3114-470-R 47.0 47.5+/-20% L 0.280 0.37 1.86 14 SD3114-680-R 68.0 68.6+/-20% M 0.239 0.305 2.62 12 SD3114-820-R 82.0 81.8+/-20% N 0.227 0.280 2.91 11 SD3114-101-R 100.0 101.1+/-20% O 0.213 0.252 3.30 10 SD3114-151-R 150.0 149.0+/-20% P 0.172 0.207 5.07 8 SD3114-221-R 220.0 220.9+/-20% Q 0.140 0.170 7.67 6 SD3114-331-R 330.0 329.5+/-20% R 0.113 0.139 11.78 5 (1) Open Circuit Inductance Test Parameters: 100 kHz, 0.1V rms , 0.0 Adc. (3) Isat Amperes peak for approximately 30% rolloff ( +20 C) (2) Irms: DC current for an approximate DT of 40 C without core loss. Derating is (4) K-factor: Used to determine B p-p for core loss (see graph). necessary for AC currents. PCB layout, trace thickness and width, air-flow, and B p-p = K*L*I, B p-p(mT), K: (K factor from table), L: (Inductance in uH), proximity of other heat generating components will affect the temperature rise. It (Peak to peak ripple current in Amps). is recommended that the temperature of the part not exceed +125 C under worst case operating conditions verified in the end application. Dimensions- mm BOTTOM VIEW RECOMMENDED PCB LAYOUT TOP VIEW 2.40 Pin 1 indicator 3.1 max. 1.40 Marking 3.7 max 0.70 XXX 3.1 max. 1.2 typical SCHEMATI C 1 SIDE VIEW 1.4 max 2 Part Marking: 3 Digit Marking: (1st digit: Indicates inductance value per letter in Part Marking Designator) (2nd digit: Bi-weekly production date code) (3rd digit: Last digit of the year produced). Do not route traces or vias underneath the inductor Packaging information- mm Parts packaged on 13 Diameter reel, 1.2 Dia 4,100 parts per reel. 1.5 Dia. min. +0.1/-0.0 2.00 1.75 A Bo 1 B1 12.0 10.25 +/-0.3 5.50 2 3.2 3.2 A1 A Ao 8.0 Ao = 3.9 mm A1 = 0.93 mm Bo = 3.60 mm B1 = 1.25 mm Direction of feed Ko = 1.60 mm www.eaton.com/electronics 2